Hybrid Sensor Shift Platform for OIS Actuator
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Solution Overview
Problem
Small form factor cameras face challenges with mass, magnetism, and reliability due to ceramic substrates used in optical image stabilization (OIS) mechanisms, which increase magnetic force, thermal heat, and susceptibility to fracture.
Innovation Solution
A hybrid sensor shift platform is introduced, using an organic substrate for the top layer and ceramic substrates for the lower layers, with an electroless nickel plating process and epoxy under-fill to reduce mass, magnetic interaction, and enhance flexibility and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ceramic substrates are used in the sensor shift platform, then mechanical strength and rigidity are improved, but mass increases and magnetic interaction is enhanced
Solution Approach 1:
The patent employs a hybrid substrate structure combining ceramic substrates (for mechanical strength and rigidity) with organic substrates (for reduced mass and magnetic interaction). This composite approach allows the sensor shift platform to maintain structural integrity while minimizing weight and magnetic effects, directly resolving the contradiction between strength and mass.
2Strength
If ceramic substrates are used in the sensor shift platform, then mechanical strength is improved, but magnetic interaction increases
Solution Approach 1:
The hybrid substrate structure combines ceramic and organic materials to achieve mechanical strength while minimizing magnetic interaction. The organic substrate portion reduces unwanted magnetic effects between the sensor platform and VCM magnets, while the ceramic portions maintain structural integrity.
Solution Approach 2:
Different regions of the sensor shift platform use different substrate materials optimized for their specific functions. Ceramic substrates are used where mechanical strength is critical, while organic substrates are used where reduced mass and magnetic interaction are prioritized, creating local quality variations throughout the structure.
3Weight of moving object
If organic substrate is used for the top layer, then mass is reduced, but connection reliability to ceramic substrate decreases
Solution Approach 1:
The patent introduces an under-fill epoxy material as an intermediary between the organic and ceramic substrates. This under-fill reinforces the solder bond connections, distributes mechanical stress, and enhances the reliability of the hybrid substrate assembly, compensating for the potential weakness of organic-ceramic interfaces.
4Object-generated harmful factors
If electroless nickel plating is used on organic substrate, then magnetic interaction is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent changes the plating method from electrolytic to electroless nickel plating on the organic substrate. This parameter change eliminates magnetic effects in the nickel layer while maintaining protective and conductive properties. Although electroless plating is a different process, it is a well-established manufacturing technique that manages complexity through proven processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid platform reduces the weight and magnetic interaction, improves reliability, and decreases thermal heat generation, while maintaining the necessary mechanical properties for OIS functionality.
Implementation Method 1
an electroless nickel plating process is used for the organic substrate of the hybrid sensor shift platform. An electroless nickel plating process does not magnetize the nickel plating as does the electrolytic nickel plating process
Implementation Method 2
the connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap
Implementation Method 3
the magnetic force and thus the power required to move the sensor shift platform and the thermal heat generated is significantly reduced
Implementation Method 4
an OIS actuator mechanism includes a sensor shift platform moveably mounted to a static platform... composed of an organic material... reduces mass of the hybrid sensor shift platform... the magnetic force and thus the power required to move the sensor shift platform
Data Source
AI summary
A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.