Hybrid Server Cooling via Liquid Insert and Fan
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Solution Overview
Problem
Existing blade server enclosures face challenges in effectively cooling high-performance processors due to inadequate fan cooling, leading to potential damage from excessive heat.
Innovation Solution
A hybrid cooled enclosure system that incorporates a liquid-cooled insert with a manifold supporting a chilled surface and fluid conduits to dissipate heat from processors, combined with an electric fan for additional heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fan cooling is used to remove heat from processors, then the enclosure structure is simple and easy to manufacture, but the cooling effectiveness is insufficient for high-performance processors
Solution Approach 1:
The cooling system is segmented into multiple independent chilled surfaces, each corresponding to a specific processor or heat-generating component. This allows targeted cooling where needed while maintaining simpler structures elsewhere, resolving the contradiction between cooling effectiveness and system complexity.
Solution Approach 2:
The patent transitions from purely mechanical fan cooling to a hydraulic cooling system using chilled liquid circulating through fluid conduits. This hydraulic approach provides superior heat removal capability for high-performance processors while the modular manifold design keeps the overall system complexity manageable.
2Productivity
If processor speed is increased to improve performance, then processing capability is enhanced, but heat generation increases leading to potential damage
Solution Approach 1:
The patent converts the harmful heat generated by high-speed processors into a manageable thermal flow that can be efficiently removed through the chilled surfaces. The heat transfer blocks and fluid conduits are designed to maximize heat extraction, turning the waste heat problem into a controlled thermal management process that enables sustained high-performance operation.
Solution Approach 2:
The cooling system applies different cooling strategies to different locations: high-performance processors receive intensive cooling through chilled surfaces with optimized thermal contact, while other components receive appropriate cooling levels. This localized approach allows maximum processing speed where needed while preventing heat damage through targeted thermal management.
3Adaptability or versatility
If a single cooling system serves all blade servers, then the cooling system is simple, but each blade server does not receive dedicated cooling attention
Solution Approach 1:
The cooling system is divided into multiple independent chilled surfaces, each dedicated to a specific blade server or processor. This segmentation allows each blade server to receive customized cooling attention while the modular design keeps the overall system complexity manageable through standardized components.
Solution Approach 2:
The manifold structure serves multiple functions: it distributes chilled liquid to multiple chilled surfaces, collects heated liquid from multiple sources, and provides a standardized interface for multiple blade servers. This multi-functionality achieves dedicated cooling for each server without proportionally increasing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat from high-performance processors by providing a dedicated liquid-cooled surface for each blade server, enhancing cooling efficiency and preventing damage from high temperatures.
Implementation Method 1
The chilled surface is in the heat transfer zone to engage the heat transfer block to dissipate heat from the processor
Implementation Method 2
The chilled surface has a fluid conduit running there through with a cold liquid inlet and a hot liquid outlet
Implementation Method 3
an electric fan mounted to the enclosure for dissipating heat from the enclosure
Data Source
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AI summary
A hybrid cooled blade server enclosure having a liquid-cooled insert having a chilled surface for contacting a heat exchange block on the blade server and an electric fan for removing heated air from the enclosure is provided.