Hybrid Shielding Arrangement for Lightweight EMI Enclosures

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Solution Overview

Problem

Existing shielding arrangements for larger volumes are cost-intensive and heavy due to the use of materials with high electrical conductivity, which limits their practicality and efficiency.

Innovation Solution

A shielding arrangement comprising two different electrically conductive materials, where one material with high resilience and conductivity is used for contact areas and a more cost-effective, lightweight material with lower conductivity is used for the main shielding body, connected to form a self-contained body that encloses the shielding volume without gaps, ensuring uninterrupted electrical conductivity and effective electromagnetic shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If materials with high electrical conductivity are used for shielding arrangements of larger volumes, then electromagnetic shielding effectiveness is improved, but weight and manufacturing costs increase

Engineering Contradiction:
Improveelectromagnetic shielding effectivenessVSAvoidshielding arrangement weight
Core Design Contradiction:
Object-affected harmful factorsVSWeight of moving object

Solution Approach 1:

The patent applies local quality by using copper specifically for contact areas where high conductivity and resilience are critical for electrical connection, while using aluminum for the main shielding body where lower cost and weight are prioritized. This selective material distribution optimizes performance locally rather than uniformly across the entire shielding arrangement.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining copper and aluminum in a single shielding arrangement. The first shielding body is made of copper while the second shielding body is made of aluminum, creating a hybrid structure that leverages the high conductivity of copper for contact areas and the lightweight, cost-effective properties of aluminum for the main shielding volume.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If materials with high electrical conductivity are used for shielding arrangements of larger volumes, then electromagnetic shielding effectiveness is improved, but manufacturing costs increase

Engineering Contradiction:
Improveelectromagnetic shielding effectivenessVSAvoidmanufacturing cost
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent applies local quality by using copper specifically for contact areas where high conductivity and resilience are critical for electrical connection, while using aluminum for the main shielding body where lower cost and weight are prioritized. This selective material distribution optimizes performance locally rather than uniformly across the entire shielding arrangement.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining copper and aluminum in a single shielding arrangement. The first shielding body is made of copper while the second shielding body is made of aluminum, creating a hybrid structure that leverages the high conductivity of copper for contact areas and the lightweight, cost-effective properties of aluminum for the main shielding volume.

Inventive Principle:
Principle #40Composite materials

3Weight of moving object

If different electrically conductive materials are used for different shielding bodies, then weight and cost are reduced, but electrical conductivity uniformity may be affected

Engineering Contradiction:
Improveshielding arrangement weightVSAvoidelectrical conductivity continuity
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The patent applies local quality by using copper specifically for contact areas where high conductivity and resilience are critical for electrical connection, while using aluminum for the main shielding body where lower cost and weight are prioritized. This selective material distribution optimizes performance locally rather than uniformly across the entire shielding arrangement.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent ensures equipotentiality by providing electrical connection between the first copper shielding body and the second aluminum shielding body through contact areas with contact springs. This connection equalizes the electrical potential between the two different materials, ensuring continuous shielding effectiveness despite the material transition.

Inventive Principle:
Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the weight and manufacturing costs of the shielding arrangement while maintaining effective electromagnetic shielding, allowing for versatile application in various sizes and configurations by using copper for resilient contact areas and aluminum for cost-effective, lightweight shielding.

Implementation Method 1

The first shielding body (7) and the second shielding body (9) are each a different electrically conductive material (11)

Methodology Applied
Scientific EffectElectrical conductivity: Conduction (electrical)

Data Source

PatentUS20230411909A1Shielding Arrangement, Shielded Connection and Kit for a Shielding Arrangement
Publication Date: 2023.12.21 TE CONNECTIVITY SOLUTIONS GMBH
  • US20230411909A1 patent drawing
  • US20230411909A1 patent drawing
  • US20230411909A1 patent drawing

AI summary

A shielding arrangement for electrical or electromagnetic shielding includes a first shielding body and a second shielding body connected to the first shielding body to form a shielding volume open at a pair of ends. The first shielding body and the second shielding body are each a different electrically conductive material.