Hybrid SoC Chip Architecture for CPU-FPGA Integration
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Solution Overview
Problem
Current integrated circuit designs face challenges in combining the data processing capabilities of Central Processing Units with the programmable logic features of Field Programmable Gate Arrays (FPGAs) to create versatile System on Chips (SoCs) that require a combination of fixed and programmable logic functions, leading to limitations in flexibility, power consumption, and interconnection costs.
Innovation Solution
A system-level integrated circuit chip is designed with a fixed logic module comprising a CPU, non-volatile memory, and high-speed data transmission modules, integrated with a Programmable Logic Module featuring a user-defined FPGA and programmable control module, allowing for flexible and scalable integration of processing capabilities and external interfaces like USB, HDMI, and MIPI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate devices are used for CPU and programmable logic functions, then each device can be optimized independently, but the interconnection cost and system complexity increase
Solution Approach 1:
The patent combines CPU and programmable logic device functions into a single integrated circuit chip, merging previously separate devices to reduce interconnection costs and simplify the overall system while maintaining independent optimization capabilities for each functional module
2Ease of manufacture
If multiple separate devices are integrated into a single chip, then interconnection cost and physical interfaces are reduced, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The integrated circuit chip is divided into distinct functional modules including CPU module, programmable logic module, memory module, and interface module, allowing each segment to be designed and optimized independently while maintaining overall system integration and reducing manufacturing complexity
Solution Approach 2:
The chip design incorporates universal interfaces and modular architecture that can support multiple functions and applications, reducing the need for separate dedicated components and simplifying the overall integration process
3Reliability
If fixed logic devices are used, then the circuit structure is stable and reliable, but the adaptability and reconfigurability are limited
Solution Approach 1:
The patent incorporates a programmable logic device that can be configured and reconfigured after manufacturing, allowing the circuit to dynamically adapt its logic functions based on application requirements while maintaining the stability of the underlying hardware architecture
4Adaptability or versatility
If programmable logic devices are used, then the adaptability and reconfigurability are improved, but the power consumption and logic density may be compromised
Solution Approach 1:
The patent implements a hybrid architecture where fixed logic modules handle stable, power-efficient operations while programmable logic modules provide reconfigurability only where needed, optimizing the balance between adaptability and power consumption by applying different logic types to different functional requirements
Data Source
AI summary
The present application discloses a system level integrated circuit chip, comprising a fixed logic module and a Programmable Logic Module; the fixed logic module comprising a CPU module, a non-volatile memory module, a high speed data transmission module, an analogue-to-digital and/or digital-to-analogue conversion module; the Programmable Logic Module comprising a user-defined field programmable gate array and a programmable control module; the CPU module is interconnected with the user-defined field programmable gate array and the programmable control module; the non-volatile memory is interconnected with the user-defined field programmable gate array and the programmable control module; the analogue-to-digital and/or digital-to-analogue conversion module are connected with the user-defined field programmable gate array; and the high speed data transmission module is interconnected with the user-defined field programmable gate array. The present application solves the problem of the combination of a variety of different devices and the integration of processing capabilities with different applications.