Hybrid Multi-Layer Substrate Border Connection for Flexible Packaging
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Solution Overview
Problem
Current packaging technologies for semiconductor chips require a shared substrate for connecting multiple chip devices, limiting the miniaturization and integration of electronic systems, as they are primarily designed for rigid systems and do not efficiently accommodate flexible or irregular substrates.
Innovation Solution
A method for manufacturing hybrid structures of multi-layer substrates that allows direct connection of different chip devices without a shared package substrate by separating and connecting border districts of metal and dielectric layers, enabling flexible packaging and increased integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a shared package substrate is used to connect multiple chip devices, then the connection between chip devices is established, but the package volume increases and integration density decreases
Solution Approach 1:
The patent merges multiple substrates into a hybrid structure where different substrates (rigid and flexible) are directly connected through separated border districts of metal layers, eliminating the need for a separate shared package substrate. This combining approach reduces overall package volume while maintaining high integration density by allowing chip devices to be mounted directly on the hybrid substrate structure.
Solution Approach 2:
The patent transitions from a traditional planar 2D packaging layout to a 3D hybrid structure by stacking multiple substrates vertically and connecting them through border districts. This dimensional change enables higher integration density within a reduced package volume by utilizing vertical space efficiently.
2Adaptability or versatility
If a rigid shared package substrate is used, then chip devices can be connected, but flexible packaging and microminiaturization are limited
Solution Approach 1:
The patent segments the package substrate into multiple independent substrates with different flexibility characteristics (rigid and flexible portions). This segmentation allows each substrate to be optimized for its specific function while being connected through separated border districts, enabling both flexible packaging and microminiaturization without compromising structural integrity.
Solution Approach 2:
The patent incorporates flexible substrate portions that can be bent or conform to irregular shapes, enabling flexible packaging applications. The flexible portions are connected to rigid portions through separated border districts of metal layers, maintaining electrical connectivity while allowing the package to adapt to different form factors and reduce overall volume.
3Ease of manufacture
If connectors are used to connect independent multi-layer substrates, then substrate connection is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts and removes the traditional connector components from the connection structure. Instead of using separate connectors to join independent multi-layer substrates, the invention directly connects substrates through their separated border districts of metal layers, simplifying both the connection structure and manufacturing process while reducing device complexity.
Solution Approach 2:
The patent performs preliminary separation of border districts of metal layers during the substrate manufacturing process itself, preparing the connection interfaces in advance. This preliminary action eliminates the need for complex connector assembly steps later, simplifying manufacturing and reducing device complexity by integrating the connection preparation into the base manufacturing flow.
Data Source
AI summary
Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.