Hybrid Substrate with Embedded High Density Layer

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Solution Overview

Problem

Conventional packaging of high density and low density substrates results in increased thickness and variability, which is undesirable for compact electronic devices.

Innovation Solution

A hybrid substrate design where a high density substrate layer is mounted within a cavity of a low density substrate layer, with an insulating support layer and vias connecting the two, and additional protection layers to expose circuit patterns, allowing for a compact package without thickness variation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a high density substrate layer is mounted on a low density substrate layer, then both high density and low density circuits can be integrated, but the thickness of the substrate increases and thickness variation occurs

Engineering Contradiction:

Improvecircuit integrationVSAvoidsubstrate thickness

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The high density substrate layer is embedded within a cavity formed in the low density substrate layer, creating a nested structure where one substrate is positioned inside the other. This nesting approach allows both high density and low density circuits to coexist in a vertically integrated manner while maintaining a compact overall thickness, as the high density substrate occupies the cavity space rather than adding to the external dimensions.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention transitions from a conventional planar stacking arrangement to a three-dimensional configuration by forming a cavity in the low density substrate and embedding the high density substrate within it. This dimensional change allows the high density substrate to be positioned at a different vertical level (within the cavity) rather than simply stacking on top, thereby reducing overall thickness variation and achieving a more compact package structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If a high density substrate layer is mounted on a low density substrate layer, then both high density and low density circuits can be integrated, but the thickness variation of the substrate becomes severe

Engineering Contradiction:

Improvecircuit integrationVSAvoidthickness uniformity

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

By nesting the high density substrate layer within the cavity of the low density substrate layer, the invention ensures that the high density substrate is positioned in a controlled environment with defined boundaries. The cavity acts as a precision fixture that guides and constrains the high density substrate during assembly, thereby minimizing thickness variation and improving manufacturing precision.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The cavity formed in the low density substrate layer serves as an intermediary structure that mediates between the high density and low density substrate layers. This cavity provides a controlled interface that ensures proper positioning and alignment of the high density substrate, thereby reducing thickness variation and improving the uniformity of the overall package structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If conventional packaging is used for high density and low density substrates, then both types of circuits can be packaged together, but the package size increases

Engineering Contradiction:

Improvecircuit packagingVSAvoidpackage size

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The high density substrate layer is nested within the cavity of the low density substrate layer, creating a compact package structure where one substrate is positioned inside the other. This nesting arrangement maximizes space utilization and minimizes the overall package volume, as the high density substrate occupies the internal cavity space rather than requiring additional external volume.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention utilizes three-dimensional space by forming a cavity in the low density substrate and embedding the high density substrate within it. This dimensional approach allows the package to efficiently utilize vertical space and internal volume, thereby reducing the overall package size while still accommodating both high density and low density circuits in an integrated manner.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9159693B2Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same

Publication Date: 2015.10.13 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

Provided is a hybrid substrate with high density and low density substrate areas and a method of manufacturing the same. The hybrid substrate with high density and low density substrate areas includes a low density substrate layer having a cavity and a low density area, a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area having a higher pattern density than that of the low density area, an insulating support layer comprising a deposition area formed on upper portions, lower portions and the upper and lower portions of the high density substrate layer and the low density substrate layer, insulating layer vias passing through the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer, and an outer pattern layer.