Hybrid Substrate Layout With Embedded Components for Shorter Die Routing
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Solution Overview
Problem
Conventional substrate designs face challenges in controlling the distance between dies and components, especially in complex IC packages with multiple metal layers, leading to design restrictions and reduced flexibility.
Innovation Solution
The implementation of a hybrid substrate with embedded components, where at least one die or component is embedded in a cavity within a base substrate, allowing for separate substrates to be merged and individually tested, reducing distances and enhancing design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional substrate designs with multiple metal layers are used, then electrical connectivity between dies and components is achieved, but the distance between dies and components cannot be effectively controlled, reducing design flexibility
Solution Approach 1:
The substrate system is divided into multiple separate substrates (first substrate, second substrate, third substrate) that can be individually designed, manufactured, and tested. This segmentation allows each substrate to be optimized independently for specific functions while maintaining overall system flexibility and reducing the complexity of controlling distances between components.
2Productivity
If multiple stacked substrates are used to achieve complex designs, then more functions can be integrated, but the distance between dies and components increases, reducing design efficiency
Solution Approach 1:
The patent utilizes vertical stacking of multiple substrates in the Z-dimension to integrate multiple functions, while the connection structures provide direct pathways that minimize the effective distance for signal and power transmission. This dimensional approach allows complex functionality without proportionally increasing component distances.
Solution Approach 2:
Connection structures serve as intermediaries between dies and components across different substrates, providing optimized electrical pathways that reduce the effective distance for signal and power transmission compared to conventional routing through multiple metal layers.
3Ease of manufacture
If a single integrated substrate is used, then manufacturing is simpler, but individual component testing and design optimization are limited
Solution Approach 1:
The system is segmented into multiple independent substrates that can be manufactured separately using standard processes, then assembled together. This allows each substrate to be individually tested, optimized, and replaced if needed, combining manufacturing simplicity with design flexibility.
Data Source
AI summary
In an aspect, an apparatus includes a base substrate having a first side and a second side. A first substrate on the first side of the base substrate having a first embedded component disposed in a cavity adjacent the first side of the base substrate. A second substrate is on the second side of the base substrate. A first connection structure is disposed between the first substrate and the base substrate configured to electrically couple the first substrate to the base substrate. A second connection structure is disposed between the second substrate and the base substrate configured to electrically couple the second substrate to the base substrate.