Hybrid Microelectronic Substrate for High-Density Interconnect Routing
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Solution Overview
Problem
Conventional microelectronic substrates face challenges in achieving high-density interconnect pitches due to manufacturing and thermal limitations, leading to increased costs and complexity, especially when attaching small microelectronic devices to substrates, which can result in inefficient power delivery and signal speed.
Innovation Solution
The implementation of a hybrid microelectronic substrate (HMS) that combines a low-density microelectronic substrate (LDMS) with a high-density microelectronic substrate (HDMS) embedded within a recess of the LDMS, allowing for direct attachment of high-density interconnects and efficient power and signal routing, using solder interconnects and underfill materials to manage thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional substrates are used to achieve high-density interconnect pitch, then manufacturing precision and thermal management improve, but manufacturing cost and device complexity increase significantly
Solution Approach 1:
The substrate is divided into two distinct layers: a first substrate providing mechanical support and low-density interconnects, and a second substrate providing high-density interconnects. This segmentation allows each layer to be optimized independently for its specific function, achieving high-density interconnects where needed without complicating the entire substrate structure.
Solution Approach 2:
The patent transitions from a planar single-layer substrate to a three-dimensional stacked substrate architecture. By adding the vertical dimension with multiple substrate layers, the system achieves high-density interconnects on the second substrate while the first substrate maintains lower density, effectively distributing complexity across dimensions rather than concentrating it in a single plane.
2Speed
If high-density interconnects are implemented on conventional substrates, then power delivery and signal speed improve, but manufacturing cost increases
Solution Approach 1:
The second substrate is strategically positioned to provide high-density interconnects only in the local region where microelectronic devices are attached, while the first substrate provides sufficient interconnect density for other areas. This localized approach to high density achieves the required signal speed and power delivery performance only where needed, rather than requiring high density across the entire substrate, thereby reducing manufacturing cost.
3Ease of operation
If microelectronic devices are attached directly to conventional substrates, then assembly simplicity improves, but thermal expansion management and reliability worsen
Solution Approach 1:
The stacked substrate structure functions as a composite system where the first and second substrates work together to manage thermal expansion. The different layers can be made of materials with different thermal expansion coefficients, allowing the composite structure to better accommodate thermal stresses than a single homogeneous substrate, thereby improving reliability while maintaining assembly simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable attachment of microelectronic devices at a lower cost and improved efficiency, supporting both high-density and low-density interconnects, enhancing power delivery and signal speed while minimizing the system's size and profile, suitable for applications in wearable and mobile electronics.
Implementation Method 1
coupled to a bottom surface of the recess via solder interconnects
Implementation Method 2
using solder interconnects and underfill materials to manage thermal expansion
Data Source
AI summary
Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.