Hybrid Switchgear With Spiral Semiconductor Assembly

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Solution Overview

Problem

Current switching devices for connecting/disconnecting electrical lines to/from loads face limitations in the constructive layout and positioning of semiconductor devices, which can lead to issues such as electrical arc generation and inrush currents during operation, especially at medium voltage levels.

Innovation Solution

The proposed switching device incorporates a hybrid circuit breaker design with a rolled printed circuit board and semiconductor devices arranged in a spiral path within an insulating housing, allowing for efficient current flow and arc reduction by synchronizing the movable contact with the AC waveform, and utilizing varistors for voltage limiting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a large number of semiconductor devices are used in series to withstand medium voltage, then the voltage blocking capability is improved, but the device complexity and construction difficulty increase

Engineering Contradiction:
Improvevoltage blocking capabilityVSAvoidconstruction difficulty
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent embeds the semiconductor devices within a compact insulating housing structure, nesting multiple components (semiconductor devices, varistors, connection means) in a hierarchical arrangement that maximizes space utilization and simplifies the overall construction of medium voltage switching devices

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent arranges semiconductor devices in a series configuration along the current path, utilizing the dimensional arrangement of components to achieve voltage blocking capability while maintaining a compact form factor that reduces construction complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-generated harmful factors

If the movable contact is synchronized with the AC waveform during opening operation, then electrical arc generation is reduced, but the control precision and timing accuracy requirements increase

Engineering Contradiction:
Improveelectrical arc generationVSAvoidtiming accuracy
Core Design Contradiction:
Object-generated harmful factorsVSManufacturing precision

Solution Approach 1:

The patent synchronizes the opening operation of the movable contact with the periodic zero-crossing points of the AC waveform, utilizing the natural periodicity of the alternating current to minimize electrical arc generation during contact separation

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The patent incorporates control means that monitor the AC waveform and provide feedback to timing the opening operation of the movable contact, ensuring synchronization with the current waveform to reduce arc generation while maintaining operational reliability

Inventive Principle:
Principle #23Feedback

3Object-generated harmful factors

If the movable contact is synchronized with the AC waveform during closing operation, then inrush current and transient voltages are limited, but the control complexity increases

Engineering Contradiction:
Improveinrush currentVSAvoidcontrol complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent positions the movable contact to close just before the zero-crossing point of the AC waveform, performing the closing action in advance of the current peak to prevent inrush current and transient voltage generation without requiring complex real-time control

Inventive Principle:
Principle #10Preliminary action

4Volume of moving object

If semiconductor devices are arranged in a compact configuration, then the device size is reduced, but the heat dissipation and electrical insulation challenges increase

Engineering Contradiction:
Improvedevice sizeVSAvoidheat dissipation
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent nests semiconductor devices, varistors, and connection means within a compact insulating housing, arranging components in a nested configuration that minimizes device volume while maintaining adequate spacing for heat dissipation and electrical insulation

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent introduces an insulating housing as an intermediary structure that provides both mechanical support and thermal management for the semiconductor devices, enabling compact arrangement while addressing heat dissipation and insulation requirements

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the switching device's performance by reducing electrical arcs and transient voltages, enabling reliable operation across a range of voltages while maintaining a compact and standardizable form factor, suitable for medium voltage applications.

Implementation Method 1

semiconductor devices which are electrically connected in series to each other and are suitable for blocking current flowing therethrough in a blocking direction and for conducting current flowing therethrough in an allowed direction

Methodology Applied
Scientific EffectDiode effect: Diode

Implementation Method 2

avoiding or at least reducing the generation of electrical arcs during the opening operation of the switching device

Methodology Applied
Scientific EffectElectrical arc: Electric Arc

Implementation Method 3

utilizing varistors for voltage limiting

Methodology Applied
Scientific EffectVaristor effect:

Data Source

PatentEP2523203B1Switching device and related switchgear
Publication Date: 2019.07.03 ABB (SCHWEIZ) AG
  • EP2523203B1 patent drawingFigure 1
  • EP2523203B1 patent drawingFigure 2~4
  • EP2523203B1 patent drawingFigure 5

AI summary

A switching device for connecting/disconnecting a power line to/from at least an associated electrical load comprising at least a phase having a housing which houses a movable contact couplable/separable to/from a corresponding fixed contact. The phase comprises an electrically semiconducting assembly having an insulating support operatively associated with a plurality of semiconductor devices electrically connected in series to each other; the plurality of semiconductor devices is associated and electrically connected to the fixed contact and to the movable contact, wherein the assembly is configured to be installed into the housing so as to surround at least a portion of at least one of the fixed contact and the movable contact when it is coupled to the fixed contact.