Hybrid Test Socket Structure for Stable High-Speed Contact
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Solution Overview
Problem
Conventional pogo pin-type and rubber-type sockets fail to meet customer requirements for various lengths, processing difficulties, high costs, reduced elasticity over time, and temperature sensitivity, leading to performance issues in semiconductor testing.
Innovation Solution
A hybrid test socket combining pogo pin-type and rubber-type sockets, featuring a body with an elastic insulator and contact pins with a spring mechanism and conductive particles, providing improved elasticity, alignment, and noise shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the contact pin length is increased to meet customer requirements, then the spring contact can accommodate longer lengths, but the pin hole processing becomes more difficult and costly
Solution Approach 1:
The patent employs a spring mechanism that allows the contact pin to dynamically adjust its length and positioning. The spring enables the contact pin to extend or compress as needed, eliminating the requirement for fixed-length pin holes and allowing flexible accommodation of various contact pin lengths without reprocessing the housing.
Solution Approach 2:
The spring contact mechanism changes the physical state of the contact pin from a rigid fixed-length structure to a flexible variable-length structure. This parameter change allows the same pin hole to accommodate contact pins of different lengths through spring compression and extension, rather than requiring precise processing for each specific length.
2Speed
If the contact pin is made finer for faster data processing and lower power consumption, then performance improves, but the pin hole processing difficulty and cost increase
Solution Approach 1:
The spring mechanism provides dynamic adjustment capability that compensates for variations in contact pin dimensions. Even when contact pins are made finer for high-speed performance, the spring allows for tolerance compensation and positioning adjustment, making the processing of small-diameter pin holes more feasible and less costly.
3Stability of the object's composition
If rubber-type socket is used to provide elasticity, then the socket has elastic property, but the elastic response speed is slower compared to pin-type contact
Solution Approach 1:
The patent merges the advantages of both rubber-type sockets (elasticity) and pin-type contacts (fast response) into a hybrid structure. The spring mechanism provides rapid elastic response similar to metal springs, while the rubber material maintains the elastic properties and shock absorption capabilities, achieving both fast response and sustained elasticity.
Solution Approach 2:
The hybrid test socket uses composite construction combining metal spring components with rubber insulating material. The metal spring provides fast elastic response for high-speed signaling, while the rubber material provides insulation and supplementary elasticity, creating a composite structure that overcomes the limitations of either material alone.
4Stability of the object's composition
If rubber-type socket is used, then the socket has elastic property, but it loses elasticity during repeated testing reducing service lifespan
Solution Approach 1:
The hybrid design combines the fatigue resistance of metal springs with the elastic properties of rubber. The metal spring maintains its elastic force over repeated compression cycles without significant degradation, while the rubber material provides insulation and supplementary elasticity, together extending service lifespan compared to pure rubber sockets.
Solution Approach 2:
The patent replaces the purely rubber-based elastic mechanism with a metal spring mechanism that provides the elastic force. Metal springs have superior fatigue resistance and maintain their mechanical properties over thousands of compression cycles, whereas rubber degrades over time. This substitution dramatically extends the duration of reliable operation.
5Stability of the object's composition
If rubber-type socket is used, then the socket has elastic property, but the elastic rebound force becomes zero or significantly reduced during continuous compression tests causing short circuit
Solution Approach 1:
The metal spring mechanism replaces the rubber-based elastic system to provide the rebound force. Metal springs maintain consistent elastic force over continuous compression cycles due to their superior fatigue resistance, ensuring reliable contact separation and preventing short circuits during extended testing operations.
6Stability of the object's composition
If rubber-type socket is used, then the socket has elastic property, but the elastic property is greatly affected by temperature
Solution Approach 1:
The metal spring provides the primary elastic mechanism, and metal materials generally have lower temperature sensitivity compared to rubber. The elastic properties of metal springs remain relatively stable across a wider temperature range, reducing the temperature-dependent variability that plagues rubber-based elastic systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid test socket offers enhanced durability, improved coaxial alignment, reduced noise, and temperature stability, suitable for high-speed signal testing with varied contact pin types.
Implementation Method 1
a contact inserted into the hole to thus allow one end in contact with the terminal of the semiconductor device and the other end in contact with the pad of the test device, thereby having elasticity in a pressing direction
Implementation Method 2
conventional pogo pin-type spring contacts
Data Source
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AI summary
Disclosed is a hybrid test socket including: a body having a hole passing through a first surface facing a terminal of a semiconductor device and a second surface facing a pad of a test device; a contact inserted into the hole to thus allow one end in contact with the terminal of the semiconductor device and the other end in contact with the pad of the test device, thereby having elasticity in a pressing direction; and a first member bonded to one end of the contact.