Hybrid Thermal Interface Material That Boosts Heat Transfer Without Scratching
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Solution Overview
Problem
Conventional thermal interface materials (TIMs) face challenges in achieving high thermal conductivity without scratching surfaces and are often costly, limiting their effectiveness in high-powered computing devices where heat management is critical.
Innovation Solution
A hybrid thermal interface material composed of diamond particles, a matrix material, and larger filler particles with a specific size distribution, where diamond particles are small enough to avoid scratching and are used in low concentrations to enhance thermal conductivity while maintaining cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If diamond particles are used to enhance thermal conductivity, then thermal conductivity is improved, but surface scratching occurs due to the hardness and size of diamond particles
Solution Approach 1:
The patent applies parameter changes by reducing diamond particle size to the nanoscale (1,000 nm or less) and controlling diamond concentration (0.5-5 wt.%). This transforms diamond particles from a harmful factor (scratching surfaces when large) to a beneficial factor (enhancing thermal conductivity when small), thereby resolving the contradiction between thermal conductivity improvement and surface protection.
Solution Approach 2:
The patent creates a composite thermal interface material combining diamond particles with matrix material and optional larger filler particles (1-100 microns). This composite structure allows the diamond nanoparticles to provide thermal conductivity enhancement while the matrix and larger particles provide structural support and surface protection, resolving the contradiction between thermal performance and surface integrity.
2Temperature
If high concentrations of diamond particles are used to achieve high thermal conductivity, then thermal conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent optimizes the concentration parameter of diamond particles to a specific range (0.5-5 wt.%), which is sufficient to achieve high thermal conductivity (6 W/(m K) or more) while avoiding the excessive cost associated with higher concentrations. This parameter optimization resolves the contradiction between thermal performance and manufacturing cost.
Solution Approach 2:
The patent employs a cost-effective matrix material that can be easily manufactured and applied, making the overall thermal interface material more economically viable. The matrix material serves as a cost-effective base that allows the use of small amounts of expensive diamond particles while achieving the desired thermal performance at a reasonable manufacturing cost.
3Strength
If larger filler particles are used to provide mechanical strength, then structural integrity is improved, but thermal conductivity decreases due to less efficient heat transfer
Solution Approach 1:
The patent merges two types of particles with complementary functions: larger filler particles (1-100 microns) that provide mechanical strength and structural integrity, and nanoscale diamond particles (1,000 nm or less) that provide superior thermal conductivity. The combination of these particles in a matrix material allows the system to achieve both mechanical strength and high thermal conductivity, resolving the contradiction between structural integrity and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material achieves thermal conductivity of 6 W/(m K) or more, effectively managing heat in high-powered computing devices without surface damage, offering improved performance over conventional TIMs.
Implementation Method 1
Thermal Interface Materials (TIMs) are a category of compounds used to aid thermal conduction between mechanically-mated surfaces
Implementation Method 2
The thermal interface material can include a volatile hydrocarbon material, the volatile hydrocarbon material composing 10 wt. % or less of the thermal interface material
Data Source
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AI summary
A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler including: particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material; and diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material.