Hybrid Thermal Sensing for Multi-Core Processor Boost

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Solution Overview

Problem

Modern CMOS integrated circuits face challenges in accurately determining the thermal limits of microprocessors, leading to conservative power state adjustments due to difficulties in estimating the available boost in performance without exceeding thermal limits, especially when ambient temperatures are not at worst-case levels.

Innovation Solution

The implementation of hybrid thermal sensing, which combines calculated temperatures based on estimated power consumption with measured temperatures from distributed sensors, allows the system management unit to accurately determine the system temperature and safely boost performance states of processor cores, utilizing available thermal headroom more effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the clock frequency and power supply voltage are increased to improve performance, then the processing speed is improved, but the die temperature increases making it harder to remain within thermal limits

Engineering Contradiction:
Improveclock frequencyVSAvoiddie temperature
Core Design Contradiction:
SpeedVSTemperature

Solution Approach 1:

The patent implements a feedback mechanism where the performance state booster continuously monitors the current performance state and dynamically adjusts it based on available thermal headroom. The system calculates the difference between the current temperature and the maximum allowable temperature, then uses this feedback to determine safe performance increases, preventing thermal violations while maximizing performance.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent makes the performance state dynamic by allowing continuous adjustment of clock frequency and power supply voltage based on real-time thermal conditions. Instead of fixed performance states, the system adapts performance levels dynamically according to the calculated thermal headroom, enabling flexible optimization between performance and thermal constraints.

Inventive Principle:
Principle #15Dynamics

2Reliability

If thermal sensors are used to check die temperature and reduce clock frequency when too hot, then thermal limits are maintained, but it becomes difficult to estimate how much the power state can be increased when temperature is below thermal limits

Engineering Contradiction:
Improvethermal limit complianceVSAvoidthermal headroom estimation
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent introduces an intermediary calculation layer that processes both sensor data and power state information. The performance state booster calculates an intermediate value representing available thermal headroom by combining temperature sensor readings with estimates of power consumption and thermal characteristics. This intermediary calculation provides more precise estimation of safe performance increase margins than temperature sensing alone.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces reliance solely on mechanical thermal sensors with a computational approach. Instead of using only hardware temperature sensors to determine performance limits, the system uses a performance state booster that computationally estimates thermal headroom by analyzing power consumption patterns, thermal characteristics, and sensor data together, providing more precise control.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If worst-case ambient temperature is assumed to determine power state boosting, then thermal safety is ensured, but the amount of available performance increase is reduced in more typical environments

Engineering Contradiction:
Improvethermal safetyVSAvoidavailable performance increase
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes the parameter used for performance state determination from a fixed worst-case ambient temperature assumption to a dynamic calculation of actual thermal headroom. The system adjusts the effective temperature parameter based on real-time conditions, power state, and thermal characteristics, allowing performance optimization for actual environmental conditions rather than conservative worst-case scenarios.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9483092B2Performance state boost for multi-core integrated circuit
Publication Date: 2016.11.01 ADVANCED MICRO DEVICES INC
  • US9483092B2 patent drawing
  • US9483092B2 patent drawing
  • US9483092B2 patent drawing

AI summary

An integrated circuit includes a multiple number of processor cores and a system management unit. The multiple number of processor cores each operate at one of a multiple number of performance states. The system management unit is coupled to the multiple number of processor cores, for setting performance states of the multiple number of processor cores. The system management unit boosts a first performance state of a first processor core of the multiple number of processor cores based on both a first temperature calculated from an estimated power consumption, and a second temperature based on a temperature measurement.