Hybrid Thermal Interface Package Structure for Warpage and Delamination
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Solution Overview
Problem
Integrated circuit packages face issues with warpage due to material differences and increased power density, leading to thermal management challenges and potential delamination problems.
Innovation Solution
The use of a combination of phase-change and liquid metal thermal interface materials (TIMs) is employed, where a phase-change material is applied on the perimeter and a liquid metal TIM is dispensed within containment regions, along with a heat sink attachment and curing process to form cross-linked gels, enhancing thermal conductivity and reducing delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If integrated circuit packages use multiple package components bonded together to increase functionality and integration level, then the functionality and integration level are improved, but warpage occurs due to material differences
Solution Approach 1:
The patent uses a phase-change thermal interface material that transitions from a solid state during assembly to a liquid state during operation. This parameter change allows the material to flow and fill gaps during bonding, then provides enhanced thermal conductivity when liquid, dynamically adapting to resolve the warpage issue while maintaining high functionality
Solution Approach 2:
The patent employs a composite thermal interface material system consisting of a phase-change material combined with liquid metal particles or droplets. This composite structure leverages the gap-filling capability of the phase-change material and the high thermal conductivity of liquid metal, simultaneously addressing warpage and thermal management in multi-component integrated circuit packages
2Area of stationary object
If the size of the packages increases, then the integration level is improved, but warpage becomes more severe
Solution Approach 1:
The phase-change material undergoes a state transition from solid to liquid at operating temperature, enabling it to flow and conform to large package geometries during assembly, then providing structural stability and thermal management when liquid, effectively scaling the solution to larger package sizes without exacerbating warpage
3Power
If power density requirements increase, then the performance is improved, but heat generation increases causing thermal management challenges
Solution Approach 1:
The thermal interface material utilizes phase transition from solid to liquid at operating temperature, where the liquid state provides superior thermal conductivity to efficiently conduct away heat from high-power-density components, directly addressing thermal management challenges while enabling high power operation
Solution Approach 2:
The composite structure of phase-change material with liquid metal particles or droplets creates a synergistic effect where the liquid metal provides exceptionally high thermal conductivity pathways, enabling effective heat dissipation from high-power-density integrated circuit packages
4Temperature
If thermal interface materials are used to manage heat, then thermal dissipation is improved, but delamination may occur due to stress in the TIM
Solution Approach 1:
The phase-change material transitions from solid to liquid, fundamentally changing its mechanical properties. In the liquid state, it becomes compliant and stress-absorbing, reducing interfacial stress and preventing delamination while maintaining excellent thermal dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively addresses thermal dissipation and delamination issues, enabling high power density packages with improved thermal resistance and reduced warpage stress, while maintaining high thermal conductivity and durability.
Implementation Method 1
A plurality of Thermal Interface Materials (TIMs) are disposed on the plurality of first package components. The materials of some of the plurality of TIMs may be different from the materials of other ones of the plurality of TIMs.
Implementation Method 2
a liquid metal TIM is dispensed within containment regions, along with a heat sink attachment
Implementation Method 3
with a curing process to form cross-linked gels, enhancing thermal conductivity and reducing delamination risks
Data Source
AI summary
Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes a package component with one or more integrated circuits adhered to a package substrate, a hybrid thermal interface material utilizing a combination of polymer based material with high elongation values and metal based material with high thermal conductivity values. The polymer based thermal interface material placed on the edge of the package component contains the metal based thermal interface material in liquid form.