Hybrid Tuner IC Integrating Terrestrial and Satellite Reception

Solution Overview

Problem

Existing hybrid tuner modules for receiving terrestrial and satellite broadcast waves are unable to significantly reduce size and cost while maintaining reception characteristics, as they require separate ICs for terrestrial and satellite wave reception circuits.

Innovation Solution

A receiver device with a configuration that includes multiple distribution circuits and high-frequency processing units on a multi-layer substrate, allowing for efficient distribution and frequency conversion of broadcast signals across different frequency bands without deteriorating reception characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate ICs are used for terrestrial and satellite wave reception circuits, then reception characteristics are maintained, but device size and cost increase

Engineering Contradiction:

Improvereception characteristicsVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines terrestrial wave reception circuit and satellite wave reception circuit into a single integrated IC chip. The terrestrial wave reception circuit includes a terrestrial wave tuner and demodulator, while the satellite wave reception circuit includes a satellite wave tuner and demodulator. Both circuits share common components such as crystal oscillators and power supply circuits within the same IC package, achieving integration of previously separate reception systems.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated IC chip is designed to perform multiple functions: it can receive both terrestrial digital television broadcasts and satellite digital television broadcasts simultaneously. The chip includes independent tuner and demodulator circuits for both terrestrial and satellite waves, allowing the single device to handle multiple broadcast standards and frequency bands without requiring separate dedicated ICs for each reception type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If separate ICs are used for terrestrial and satellite wave reception circuits, then reception characteristics are maintained, but manufacturing cost increases

Engineering Contradiction:

Improvereception characteristicsVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines terrestrial wave reception circuit and satellite wave reception circuit into a single integrated IC chip. The terrestrial wave reception circuit includes a terrestrial wave tuner and demodulator, while the satellite wave reception circuit includes a satellite wave tuner and demodulator. Both circuits share common components such as crystal oscillators and power supply circuits within the same IC package, achieving integration of previously separate reception systems.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If multiple tuners are mounted in one housing to receive multiple broadcast waves simultaneously, then reception capability is improved, but device size increases

Engineering Contradiction:

Improvereception capabilityVSAvoiddevice size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent combines terrestrial wave reception circuit and satellite wave reception circuit into a single integrated IC chip. The terrestrial wave reception circuit includes a terrestrial wave tuner and demodulator, while the satellite wave reception circuit includes a satellite wave tuner and demodulator. Both circuits share common components such as crystal oscillators and power supply circuits within the same IC package, achieving integration of previously separate reception systems.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10142672B2Receiver device

Publication Date: 2018.11.27 SONY SEMICON SOLUTIONS CORP

AI summary

There is provided a receiver device including a first input terminal, a second input terminal, a first distribution circuit, a second distribution circuit, a first high-frequency processing unit, and a second high-frequency processing unit.