Hybrid Two-Phase Air Cooling for Data Centers
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Solution Overview
Problem
Current cooling systems for electronic components in data centers and telecommunications systems are inefficient in energy consumption, require active control, and are costly, while also expelling hot air into the environment, which can lead to thermal management issues.
Innovation Solution
A hybrid cooling system combining two-phase cooling and air-cooling systems, where the two-phase cooling system uses a thermosyphon loop with an evaporator, condenser, and riser to efficiently transfer heat, and the air-cooling system recirculates air using fans and baffles to prevent heat expulsion, with supplemental air-cooling for low-heat components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional air-cooling systems are used to cool electronic components, then the system is simple to implement, but energy consumption is high and active control is required
Solution Approach 1:
The patent employs two-phase cooling systems where a working fluid undergoes phase transitions (evaporation and condensation) to transfer heat from electronic components. The evaporator absorbs heat by evaporating the working fluid, and the condenser rejects heat by condensing the vapor, eliminating the need for high-energy fans and active control while maintaining effective cooling
Solution Approach 2:
The thermosyphon loop enables passive two-phase cooling by utilizing natural convection and phase change dynamics. The working fluid circulates automatically through evaporation at the heat source and condensation at the heat sink, driven by density differences and pressure gradients, without requiring external pumps or active control mechanisms
2Temperature
If conventional cooling systems expel hot air into the environment, then heat is removed from electronic components, but thermal management issues arise in the surrounding environment
Solution Approach 1:
The patent introduces a secondary cooling system as an intermediary between the electronic components and the environment. The two-phase cooling system transfers heat to a working fluid, which then carries it to a condenser that rejects heat to ambient air through heat exchange surfaces, preventing direct hot air expulsion while maintaining thermal management
Solution Approach 2:
The patent replaces conventional forced-air cooling mechanisms (fans, blowers) with a two-phase thermodynamic system. Heat is removed from components through phase change and natural convection in a closed loop, substituting mechanical air movement with thermodynamic heat transfer, thereby eliminating hot air expulsion issues
3Reliability
If active control is implemented in cooling systems, then cooling performance can be optimized, but system complexity and costs increase
Solution Approach 1:
The two-phase cooling system is designed to self-regulate based on heat load conditions. The working fluid automatically adjusts its evaporation and condensation rates in response to temperature and pressure changes, providing adaptive cooling performance without external control systems, sensors, or actuators
Solution Approach 2:
The patent replaces active electronic control systems with passive thermodynamic mechanisms. The two-phase heat transfer process inherently responds to thermal conditions through phase change physics, eliminating the need for controllers, sensors, and power consumption associated with active control while maintaining reliable cooling performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This hybrid system effectively reduces energy consumption, minimizes active control requirements, lowers costs, and prevents heat expulsion into the environment by efficiently transferring heat from high-heat components to a secondary cooling system, while providing supplementary cooling for low-heat components.
Implementation Method 1
at least one two-phase cooling system configured to cool one or more electronic components
Implementation Method 2
the two-phase cooling system uses a thermosyphon loop with an evaporator, condenser, and riser to efficiently transfer heat
Implementation Method 3
the two-phase cooling system uses a thermosyphon loop with an evaporator, condenser, and riser to efficiently transfer heat
Implementation Method 4
the two-phase cooling system uses a thermosyphon loop with an evaporator, condenser, and riser to efficiently transfer heat
Implementation Method 5
the air-cooling system recirculates air using fans and baffles to prevent heat expulsion
Data Source
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AI summary
Examples of the disclosure relate to a cooling system for cooling one or more electronic components. The cooling system comprises at least one two-phase cooling system configured to cool one or more electronic components that are thermally coupled to the at least one two-phase cooling system and at least one air-cooling system configured to cool one or more electronic components. The at least one air-cooling system comprises at least one heat exchanger within the at least one air-cooling system wherein the at least one heat exchanger is coupled to a two-phase cooling system or a liquid phase cooling system. The at least one air-cooling system also comprises recirculation means configured to re-circulate air through the at least one air-cooling system to the one or more electronic components.