Wafer Cleaning Transfer Layout for Particle-Safe Hybrid Processing
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Solution Overview
Problem
Current semiconductor wafer cleaning methods, either batch or single wafer cleaning, face challenges in controlling contaminants and particles during the transition from batch cleaning to single wafer cleaning, leading to contamination and reduced throughput.
Innovation Solution
A method and apparatus that involve transferring wafers through a series of tanks and modules while maintaining a controlled liquid film on the wafers to prevent particle attachment, using robots and nozzles to manage the liquid film thickness during the transfer process from batch cleaning tanks to single wafer cleaning modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If batch cleaning is used to clean multiple wafers simultaneously, then cleaning efficiency is improved, but cross contamination among wafers occurs
Solution Approach 1:
The batch cleaning process is segmented into multiple independent cleaning tanks (first cleaning tank, second cleaning tank, third cleaning tank), where each tank performs a specific cleaning function. Wafers are transferred sequentially through these tanks, combining the efficiency of batch processing with the contamination control of individual cleaning stages.
Solution Approach 2:
A liquid film is maintained as an intermediary protective layer on the wafer surface during transfer between tanks. This liquid film prevents direct contact between contaminants and the wafer surface, reducing cross contamination while maintaining batch cleaning efficiency.
2Device complexity
If wafers are transferred vertically out of cleaning tanks, then space is saved, but particles and contaminants adhere to wafer surfaces
Solution Approach 1:
The wafer transfer orientation is changed from vertical to horizontal. Wafers are transferred horizontally between tanks and modules, which prevents particles and contaminants from adhering to the wafer surface during transfer, eliminating the contamination problem associated with vertical transfer.
3Object-affected harmful factors
If single wafer cleaning is used to avoid cross contamination, then cleaning quality is improved, but throughput decreases
Solution Approach 1:
The invention merges the advantages of batch cleaning (high throughput) and single wafer cleaning (high quality) by implementing a hybrid system. Multiple wafers are processed in parallel through the same cleaning pathway, achieving batch cleaning efficiency while maintaining single wafer cleaning quality through controlled liquid film and horizontal transfer.
4Object-affected harmful factors
If high temperature SPM is used for cleaning, then removal of photoresist and organics is improved, but cleaning cost increases
Solution Approach 1:
A liquid film is applied to the wafer surface before the main high-temperature SPM cleaning process. This preliminary liquid film reduces the direct contact time and quantity of expensive high-temperature SPM needed, while still achieving effective photoresist and organic removal.
Data Source
AI summary
The invention provides an apparatus for cleaning semiconductor wafers. The apparatus includes at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; one or more single wafer cleaning modules, configured to implement single wafer cleaning and drying processes; a plurality of robots, configured to transfer one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules; and a controller, configured to control the plurality of robots to transfer the one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules.