Hybrid Dielectric-Conductor Waveguide for Chip-to-Chip Bandwidth

Solution Overview

Problem

Conductor-based interconnects face limitations in channel bandwidth due to the skin effect, while optic-based interconnects are costly and not fully replaceable, necessitating a high-speed, cost-effective solution for chip-to-chip communication.

Innovation Solution

A waveguide comprising a dielectric part and a conductor part surrounding at least part of the dielectric part, where signals of different frequency bands are transmitted through the dielectric and conductor parts respectively, with a microstrip circuit coupling to manage signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conductor-based interconnects are used for data transmission, then cost and power efficiency are improved, but channel bandwidth is limited due to skin effect

Engineering Contradiction:

Core Design Contradiction:

Loss of energyVSProductivity

Solution Approach 1:

The waveguide structure is segmented into a dielectric core and a conductor cladding, where each segment handles different frequency components of the signal. The dielectric core transmits high-frequency signals while the conductor cladding transmits low-frequency signals, thereby resolving the bandwidth limitation of traditional conductor-based interconnects while maintaining cost-effectiveness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The waveguide employs a composite structure combining dielectric material (core) and conductive material (cladding). This composite design leverages the advantages of both materials: the dielectric provides high-speed signal transmission capability while the conductor provides cost-effectiveness and low-frequency transmission capability, thus resolving the contradiction between power efficiency and channel bandwidth.

Inventive Principle:

Principle #40Composite materials

2Productivity

If optic-based interconnects are used to increase data transmission speed, then channel bandwidth is improved, but installation and maintenance costs increase

Engineering Contradiction:

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The waveguide applies local quality by using dielectric material specifically in the core region where high-frequency signal transmission is required, while using conductor material in the cladding region for cost-effectiveness and low-frequency transmission. This localized material assignment enables high-speed transmission capability without incurring the high costs associated with fully optical interconnects.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The waveguide structure serves multiple functions: it provides high-speed signal transmission through the dielectric core, cost-effective implementation through the conductor cladding, and low-frequency signal transmission through the same conductor cladding. This multi-functionality allows a single structure to replace both traditional conductor interconnects and expensive optical interconnects.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Device complexity

If a single waveguide transmits multiple frequency bands, then device complexity is reduced, but signal interference between frequency bands may increase

Engineering Contradiction:

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The waveguide is segmented into functional regions (dielectric core and conductor cladding) that handle different frequency bands separately. This spatial segmentation of frequency bands within the single waveguide structure minimizes signal interference between different frequency bands while maintaining device simplicity.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective transmission of electromagnetic wave signals of various frequency bands using a single waveguide, minimizing interference and maintaining high performance across frequency bands.

Implementation Method 1

a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band is transmitted through the dielectric part

Methodology Applied

Scientific EffectDielectric transmission: Dielectric

Implementation Method 2

a conductor part surrounding at least a part of the dielectric part, wherein a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10777865B2Chip-to-chip interface comprising a waveguide with a dielectric part and a conductive part, where the dielectric part transmits signals in a first frequency band and the conductive part transmits signals in a second frequency band

Publication Date: 2020.09.15

AI summary

The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band is transmitted through the dielectric part, and a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part.