Hydraulic Element Pressing for Multi-Height Electronic Component Bonding
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Solution Overview
Problem
The existing solid-state diffusion bonding methods face challenges in miniaturization and productivity due to the need for high pressure and longer times, as well as difficulties in achieving a highly close contact state between electrode terminals and electrodes, especially when dealing with electronic components of varying heights and small pitch distances.
Innovation Solution
An element pressing apparatus with a base casing, oil encapsulation, and an oil seal member that changes pressure to press electrode terminals against electrodes, allowing for simultaneous pressing and heating of components with different heights, using a hydraulic pressure change mechanism and a heating furnace for efficient bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual heaters and motors are used for each electronic component to apply predetermined temperature and pressure, then bonding quality is improved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent merges multiple individual heaters into a single heating furnace that can heat multiple electronic components simultaneously. It also combines multiple pressing motors into a single pressing mechanism that applies pressure to all components at once. This consolidation maintains bonding quality while significantly improving productivity by processing multiple components in parallel rather than sequentially.
Solution Approach 2:
The heating furnace and pressing mechanism are designed as universal devices that can simultaneously serve multiple electronic components with different heights. The pressing mechanism includes adjustable pressing members that can adapt to varying component heights, allowing a single device to perform the function of multiple individual units while maintaining optimal bonding conditions for each component.
2Manufacturing precision
If individual heaters and motors are used for each electronic component, then bonding precision is improved, but device complexity increases
Solution Approach 1:
The patent consolidates multiple heating devices into one heating furnace and multiple pressing mechanisms into one pressing system. This reduction in the number of individual components directly lowers device complexity while maintaining bonding precision through centralized control and uniform heating/pressing conditions across all electronic components.
Solution Approach 2:
The pressing mechanism incorporates dynamic adjustment capabilities with pressing members that can independently adjust their position and pressure application points. This dynamic adaptability allows the system to handle electronic components of varying heights and configurations, maintaining bonding precision without requiring separate fixed mechanisms for each component type.
3Strength
If high pressure is applied for sufficient diffusion reaction, then bonding strength is improved, but processing time increases
Solution Approach 1:
The patent employs parameter changes by applying both temperature and pressure simultaneously in a coordinated manner. The heating furnace raises the temperature to accelerate diffusion reactions, while the pressing mechanism applies sufficient pressure to maintain intimate contact between bonding surfaces. This combined parameter approach achieves strong bonding faster than pressure alone, reducing processing time while maintaining bonding strength.
Solution Approach 2:
The system maintains continuous heating and pressing throughout the bonding process without interruption. The heating furnace continuously provides thermal energy to drive diffusion reactions, while the pressing mechanism continuously applies pressure to ensure intimate contact. This continuous application of both parameters maximizes bonding efficiency and reduces total processing time compared to intermittent or sequential approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a highly close contact state and excellent bonding while improving miniaturization and productivity by allowing for efficient pressing and heating of electronic components with varying heights, overcoming the limitations of traditional methods.
Implementation Method 1
an oil seal member that seals the oil in the arrangement space and is deformed depending on a pressure of the oil; and a hydraulic pressure change portion that is supported by the base casing and changes the pressure of the oil
Implementation Method 2
a heating system using the element pressing apparatus... the element pressing apparatus is heated in a heating furnace having a heater
Implementation Method 3
The solid-state diffusion bonding method is a method of using an atom diffusion phenomenon generated between metals (electrodes) insoluble by heating or pressing under a certain condition
Data Source
AI summary
An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.