Hydrogen Stripping of Flexible Substrates via Electrolysis
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Solution Overview
Problem
Current methods for stripping flexible substrates from rigid substrates, such as laser ablation and chemical corrosion, are inefficient, costly, and prone to damaging the flexible display, limiting large-scale production and increasing costs.
Innovation Solution
A method involving a porous metal substrate with a buffer layer, where an electrolytic device is used to electrolyze water, generating hydrogen that gently strips the flexible substrate from the substrate without damaging it, allowing for efficient and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser ablation is used to strip the flexible substrate from the rigid substrate, then mass production is achieved, but the scan dimension of the laser restricts the mass production rate and heat energy causes damage to the flexible display film
Solution Approach 1:
The patent replaces the laser ablation method (thermal/mechanical system) with an electrolytic method (chemical system). The electrolytic device uses electrochemical reactions to detach the flexible substrate from the rigid substrate without generating harmful heat, thereby eliminating heat damage while maintaining mass production capability
Solution Approach 2:
The patent changes the fundamental parameter of the stripping mechanism from thermal energy (laser) to chemical energy (electrolyte solution). By using electrolytic reactions instead of laser ablation, the process achieves high-speed mass production without the heat damage associated with laser methods
2Productivity
If laser ablation is used to strip the flexible substrate, then mass production is achieved, but the operation is complicated and the apparatus is expensive
Solution Approach 1:
The patent replaces the complex laser ablation apparatus and operation with a simpler electrolytic device. The electrolytic method uses basic electrochemical principles that are easier to implement and operate, reducing both device complexity and operational complexity while maintaining mass production capability
Solution Approach 2:
The patent employs an electrolyte solution that can be easily replenished and replaced, making the overall system more cost-effective. The electrolytic method uses inexpensive chemical reagents compared to expensive laser equipment, reducing apparatus cost and operational complexity
3Productivity
If chemical method is used to corrode the stainless steel substrate for stripping, then the flexible substrate is detached, but the chemical solution also corrodes the flexible element decreasing lifetime
Solution Approach 1:
The patent applies local quality by using a buffer layer with specific properties (different from both the flexible substrate and rigid substrate) that creates selective chemical reactivity. The electrolyte solution reacts with the buffer layer to enable detachment while the flexible substrate itself remains protected due to its different chemical composition, preventing corrosion damage and maintaining product lifetime
Solution Approach 2:
The buffer layer acts as an intermediary between the flexible substrate and rigid substrate. During electrolytic stripping, the buffer layer is selectively removed while protecting the flexible substrate from direct contact with the electrolyte solution, thus preventing corrosion of the flexible display elements and maintaining product reliability
4Productivity
If resistor heating method is used to detach the substrate and glass, then detachment is achieved, but over high temperature requires additional protection process for light emitting element
Solution Approach 1:
The patent replaces the resistor heating method (thermal system) with an electrolytic method (chemical system). This substitution eliminates the need for high temperatures and associated protection processes, achieving rapid detachment without adding device complexity or requiring additional protective steps for light emitting elements
5Productivity
If second rigid substrate method is used for stripping, then the flexible substrate is detached from the rigid substrate, but separating the flexible substrate and second rigid substrate causes damage to the flexible substrate
Solution Approach 1:
The patent uses local quality through the buffer layer's selective chemical reactivity. The electrolyte solution is designed to react specifically with the buffer layer material, enabling clean detachment of the flexible substrate from the rigid substrate without causing damage. The localized chemical reaction at the buffer layer interface ensures precise and damage-free separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production yield and reduces costs by ensuring a faster, damage-free stripping process, allowing for repeated use of the porous metal substrate and maintaining the integrity of the flexible substrate and its elements.
Implementation Method 1
a power source is applied between the porous metal substrate and the anode to electrolyze water in the electrolyte, and the water near the porous metal substrate and in the holes inside the porous metal substrate is electrolyzed to generate hydrogen
Data Source
AI summary
The present invention provides a stripping method of a flexible substrate, comprising: providing a porous metal substrate; forming a buffer layer on the porous metal substrate; forming a flexible substrate on the buffer layer; putting the flexible substrate in the electrolytic tank so that the part of the porous metal substrate is immersed in the electrolyte, and the porous metal substrate is employed to be a cathode electrified to electrolyze water in the electrolyte, and the porous metal substrate will releases the hydrogen, and the flexible substrate and the buffer layer are stripped from the porous metal substrate with the acting force of the hydrogen to obtain the flexible substrate with the buffer layer at the bottom. The method is high efficient and without damaging to promote the production yield of the flexible substrate.