Substrate Drying Chamber with Hydrophobizing Vapor for Pattern Collapse
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Solution Overview
Problem
The challenge in substrate drying processes is the collapse of circuit patterns on semiconductor wafers due to surface tension of liquids, which existing techniques fail to adequately prevent or reduce, particularly due to particle contamination and residue attachment.
Innovation Solution
A substrate processing apparatus is designed with a chamber system that includes nozzles for hydrophobizing agents and organic solvents, which vaporizes solvents to replace processing liquids, and exhaust ports to manage gas, thereby reducing pattern collapse by controlling the environment and cleaning the chamber to prevent particle attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a liquid process is performed on substrates, then the substrates are processed with liquid chemicals, but pattern collapse occurs due to surface tension of the liquid
Solution Approach 1:
The patent changes the physical state of the processing medium from liquid to vapor phase. By performing the drying process using vaporized organic solvent instead of liquid, the surface tension that causes pattern collapse is eliminated while still achieving effective substrate processing and drying.
Solution Approach 2:
The patent utilizes phase transition by vaporizing the organic solvent to perform the drying process. The organic solvent is heated to transition from liquid to vapor state, allowing it to contact and dry the substrates without the harmful surface tension effects of liquid phase, then condensed or removed after use.
2Manufacturing precision
If organic solvent is used to replace processing liquid, then pattern collapse is reduced, but particle contamination and residue attachment occur
Solution Approach 1:
The patent creates a controlled vapor phase environment using organic solvent vapor that acts as an inert medium for the drying process. This vapor atmosphere replaces the liquid environment and reduces particle contamination by eliminating liquid-borne particles while still achieving effective drying through vapor condensation on the substrates.
Solution Approach 2:
The patent replaces the mechanical liquid handling system with a vapor-phase system. Instead of using liquid flow and mechanical contact for drying, the system uses vapor diffusion and condensation, which eliminates mechanical particle generation and reduces residue attachment associated with liquid processing.
3Productivity
If multiple substrates are processed collectively, then productivity increases, but particle contamination risk increases
Solution Approach 1:
The patent implements a multi-functional vapor processing system that can simultaneously process multiple substrates in a single chamber. The organic solvent vapor serves multiple functions: it acts as the drying medium for all substrates, creates a uniform controlled atmosphere, and can be easily removed or recycled, enabling collective processing without proportionally increasing particle contamination risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents or reduces pattern collapse by using vaporized organic solvents to replace liquids on substrates and cleaning the chamber, ensuring efficient drying and minimizing particle-induced pattern damage.
Implementation Method 1
The hydrophobizing agent nozzle supplies a vapor of a hydrophobizing agent to the drying area
Implementation Method 2
The second organic solvent nozzle supplies a vapor of an organic solvent to the drying area
Implementation Method 3
subsequently removing such an organic solvent from such a substrate by volatilization thereof
Data Source
AI summary
A substrate processing apparatus includes a chamber, a holding unit, a hydrophobizing agent nozzle, a first organic solvent nozzle, a second organic solvent nozzle, and an exhaust port. The chamber has a gastight space that is capable of accommodating the plurality of substrates. The holding unit lifts or lowers the plurality of substrates between a storage area where a liquid is stored in the gastight space and a drying area that is located above the storage area in the gastight space. The hydrophobizing agent nozzle supplies a vapor of a hydrophobizing agent to the drying area. The first organic solvent nozzle supplies an organic solvent from the drying area to the storage area. The second organic solvent nozzle supplies a vapor of an organic solvent to the drying area. The exhaust port discharges a gas in the gastight space.