Hydrosilylation Adhesive Composition for Wafer Bonding and Easy Release
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Solution Overview
Problem
Existing temporary adhesives used for bonding semiconductor wafers to supports during polishing have curing start temperatures that are too low, leading to premature curing and inadequate bonding.
Innovation Solution
An adhesive composition cured by a hydrosilylation reaction, containing a platinum group metal-based catalyst and a specific compound represented by Formula (1), along with components (A-1) and (A-2), which increases the curing start temperature and allows for easy release after processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a temporary adhesive with low curing start temperature is used, then the adhesive can cure easily, but curing proceeds before sufficient bonding is achieved, preventing appropriate bonding
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive system by introducing a polymerization inhibitor and specific catalyst combinations, which shifts the curing start temperature from below room temperature to above room temperature, ensuring bonding occurs before curing begins
Solution Approach 2:
The patent uses a polymerization inhibitor as an intermediary substance that delays the curing reaction until appropriate bonding is achieved. The inhibitor acts as a mediator between the adhesive components and the curing process, controlling the timing of gelation
2Strength
If a strong temporary adhesion is used to withstand polishing stress, then the semiconductor wafer remains stable during polishing, but the wafer becomes difficult to remove and may be cut or deformed
Solution Approach 1:
The patent creates a dynamic adhesion system where the adhesive strength changes over time and conditions. The adhesive provides strong bonding during polishing but allows easy release afterward through controlled degradation mechanisms, transforming a static strong-bonding system into a dynamic one with adjustable strength
Solution Approach 2:
The patent incorporates a release agent layer as a protective cushion between the adhesive and the semiconductor wafer. This layer provides beforehand protection against excessive bonding strength, allowing the adhesive to be strong during processing while enabling easy release afterward without damaging the wafer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively raises the curing start temperature, ensuring proper bonding during polishing and easy removal of semiconductor wafers without deformation, using a laminate structure with a release agent layer.
Implementation Method 1
an adhesive composition cured by a hydrosilylation reaction, containing a platinum group metal-based catalyst and a compound represented by Formula (1)
Implementation Method 2
containing a platinum group metal-based catalyst
Implementation Method 3
a polymerization inhibitor (B) having a 5% mass reduction temperature at Tg-DTA of 80°C or higher
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
An adhesive composition cured by a hydrosilylation reaction, containing a platinum group metal-based catalyst and a compound represented by Formula (1) below. (In Formula (1), R1 and R2 each independently represent a monovalent group.)