Hydroxide-Loaded Silicone Adhesive for Induction Disassembly
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Solution Overview
Problem
Existing methods for disassembling assemblies bonded with silicone-based adhesives are inefficient and energy-intensive, making recycling difficult due to the adhesive's heat resistance and lack of easy separation mechanisms.
Innovation Solution
A method involving a curable liquid silicone adhesive containing 25 to 80% by weight of a hydroxide compound with a decomposition temperature of 180 to 600°C and up to 3% by weight of a material capable of heat generation by electromagnetic induction, allowing for disassembly by heating the metal portion of the bond interface using electromagnetic induction, facilitating easy separation and recycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicone base adhesive is used to provide heat resistance and sealing performance, then sealing performance is improved, but disassembly difficulty increases
Solution Approach 1:
A release agent is incorporated into the adhesive formulation in advance, which remains dormant during normal service but activates under specific conditions (heat + moisture) to enable future disassembly. This preliminary inclusion of the release mechanism allows the adhesive to maintain strong bonding during use while enabling easy separation when needed.
Solution Approach 2:
The adhesive's properties are changed by incorporating a release agent that becomes active under specific temperature and moisture conditions. During normal service at room temperature, the adhesive maintains strong bonding. When disassembly is needed, heating to 150-200°C and exposing to moisture activates the release agent, changing the adhesive's properties to enable easy separation.
2Ease of operation
If heating is applied to decompose the adhesive for disassembly, then disassembly is enabled, but energy consumption increases
Solution Approach 1:
The release agent undergoes a phase transition or chemical activation at a specific temperature range (150-200°C). By designing the adhesive to decompose or activate the release mechanism within this controlled temperature range, the energy required for disassembly is optimized - high enough to activate the release agent but not excessively high to waste energy.
Solution Approach 2:
The release agent acts as an intermediary substance that mediates between the adhesive and the substrates. It remains embedded in the adhesive during normal use but becomes active under heat and moisture, facilitating separation without requiring direct decomposition of the entire adhesive structure, thus reducing the energy required for disassembly.
3Ease of operation
If a release agent is added to the adhesive, then disassembly is facilitated, but thermal stability deteriorates at high temperatures
Solution Approach 1:
The release agent is designed as a temporary component that serves its purpose during disassembly and then decomposes or becomes inactive. It is present in the adhesive formulation but does not interfere with normal thermal stability during service. After activating the disassembly process at 150-200°C, the release agent decomposes, leaving no harmful residues affecting the thermal stability of the remaining adhesive structure.
Solution Approach 2:
The release agent is formulated to become active only under specific temperature and moisture conditions. During normal service at lower temperatures, it remains dormant and does not affect thermal stability. When heating to 150-200°C and exposing to moisture, the release agent activates to enable disassembly, then decomposes after serving its function, maintaining the thermal stability of the adhesive system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables efficient disassembly and recycling of silicone-bonded assemblies in a short time with low energy consumption, maintaining sealing performance up to 150°C and allowing for easy separation of bonded members.
Implementation Method 1
a hydroxide compound having a decomposition temperature of 180 to 600°C
Implementation Method 2
a material capable of heat generation by electromagnetic induction
Implementation Method 3
heating the metal portion of the bond interface by electromagnetic induction
Implementation Method 4
curable liquid silicone adhesive... maintains adhesiveness even under various conditions
Data Source
Figure 1~2
AI summary
In the present invention, a bonded member is obtained by bonding together a plurality of members, including a member in which at least a portion of a bonding interface is metal, by means of a cured product obtained by curing a curable silicone-based liquid adhesive agent, which contains 25-80 mass% of a hydroxide compound having a decomposition temperature of 180-600°C and in which the content of a material for generating heat by electromagnetic induction is no more than 3 mass%. The bonded member exhibits sealing properties at room temperature and, moreover, it is possible to easily disassemble the bonded member in a short time and with little consumed energy, even after exposure to high temperatures of approximately 150°C, by heating the metal portion at the bonding interface of the bonded member by electromagnetic induction, and it is possible to recycle the disassembled member.