Hygrothermal Sensor Device with Protruding RFID Head
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Solution Overview
Problem
Existing methods for monitoring hygrothermal conditions in building envelope insulation systems are invasive, causing thermal bridges and increased moisture penetration, making it difficult to prevent and detect hygrothermal damage early, which leads to high remediation costs.
Innovation Solution
A hygrothermal sensor device with a support structure and a sensor head section that protrudes from the carrier plate, equipped with temperature, humidity, and pressure sensors, and RFID transponder electronics for wireless data transmission, allowing for non-invasive, continuous monitoring of insulation systems without introducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If wired sensors are retrofitted into the building envelope insulation system by drilling holes, then hygrothermal condition data can be measured, but thermal bridges are created and water penetration points increase
Solution Approach 1:
The patent replaces wired mechanical sensor installation with wireless RFID-based sensing. The sensor device includes RFID transponder electronics that communicate wirelessly with external readers, eliminating the need for physical cable connections through drilled holes in the insulation system.
Solution Approach 2:
The patent introduces RFID transponder electronics as an intermediary between the sensors and the external reading system. The RFID transponder stores and transmits sensor data wirelessly, acting as a mediator that eliminates direct physical connections through the insulation envelope.
2Reliability
If sensors are installed to monitor hygrothermal conditions, then early detection of damage is possible, but the installation process itself causes structural damage
Solution Approach 1:
The patent replaces mechanical sensor installation requiring drilling and cable routing with wireless RFID-based sensing. The sensor device integrates temperature, humidity, and pressure sensors with RFID transponder electronics that communicate without physical connections to the exterior.
Solution Approach 2:
The patent segments the sensor device into modular components: sensing elements (temperature, humidity, pressure sensors), processing electronics (RFID transponder), and a support structure. This modular design allows the complete sensor unit to be installed as a single non-invasive element.
3Reliability
If repair of hygrothermal damage is performed, then damage is corrected, but repair costs are very high and complexity is great
Solution Approach 1:
The patent implements continuous monitoring with feedback: sensors continuously measure temperature, humidity, and pressure conditions, the RFID transponder stores and transmits this data wirelessly, and external readers retrieve the data for analysis. This early warning system enables preventive maintenance before damage occurs.
Solution Approach 2:
The patent performs preliminary detection and warning before actual hygrothermal damage occurs. By continuously monitoring conditions and alerting to critical thresholds, the system enables preventive action to be taken before mold, algae, or structural damage develops.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables early detection of critical hygrothermal conditions, reducing remediation costs by providing precise, preventive monitoring of building envelope insulation systems, preventing damage from incorrect installation or user behavior.
Implementation Method 1
radio electronics, in particular RFID transponder electronics, for transmitting sensor data to a reader, such as an RFID reader
Implementation Method 2
temperature sensor and/or a humidity sensor, preferably for measuring relative humidity
Implementation Method 3
temperature sensor and/or a humidity sensor, preferably for measuring relative humidity
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to a sensor device, in particular a hygrothermal sensor device, for acquiring humidity and/or temperature measurement data in a building envelope insulation system, such as an external thermal insulation composite system, an internal insulation system, a roof insulation system or the like, comprising a temperature sensor and/or a humidity sensor; radio electronics, such as RFID transponder electronics, for transmitting sensor data to a reader, such as an RFID reader; and a support structure for embedding the temperature and/or humidity sensor and the radio electronics in the building envelope insulation system, wherein the support structure has a protruding sensor head section on which the temperature and/or humidity sensor is arranged.