Hyperdoped Germanium Superconducting Films With Silicon Capping

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for hyperdoping germanium with gallium to achieve superconductivity face challenges such as phase segregation and diffusion of Ga atoms, leading to inconsistent superconducting properties and reduced coherence at the Ge interface.

Innovation Solution

A method involving molecular beam epitaxy (MBE) is used to co-deposit gallium and germanium at room temperature, followed by the addition of a thin silicon cap, which is then oxidized and annealed, or deposited with intermediate silicon alloying, to suppress Ga segregation and enhance superconducting properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high energy Ga ion beams are used for hyperdoping Ge, then superconductivity is attained, but phase segregation occurs and Ga atoms diffuse to the interface

Engineering Contradiction:
ImprovesuperconductivityVSAvoidphase segregation
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

A protective oxide layer is deposited on the Ge surface before ion implantation to prevent Ga diffusion during the process. This preliminary protective action ensures that Ga atoms remain confined within the Ge matrix during high-energy implantation, achieving superconductivity without interface contamination

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Flash annealing at high temperature is applied after implantation to activate Ga acceptors and induce superconductivity. By carefully controlling the annealing temperature and duration, the process activates dopants while minimizing Ga diffusion and phase segregation

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the protective oxide layer is etched away, then the surface is cleaned, but the superconducting state disappears due to Ga diffusion

Engineering Contradiction:
Improvesurface cleanlinessVSAvoidsuperconducting state
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The protective oxide layer is maintained throughout the implantation and annealing processes to prevent Ga diffusion. Etching is performed only after superconductivity is established, and even then, the process is carefully controlled to remove only the oxide layer without causing Ga migration to the interface

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The oxide layer serves as an intermediary protective barrier between the Ga-doped Ge and the external environment. It prevents Ga diffusion during processing and can be selectively removed later without compromising the bulk superconducting properties

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If high quality epitaxial interfaces are created, then Josephson junction performance improves, but device complexity increases

Engineering Contradiction:
ImproveJosephson junction qualityVSAvoidepitaxial interface requirements
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The superconducting Ge layer is grown epitaxially on Ge substrates, merging the substrate and film into a lattice-matched structure. This eliminates dislocation defects and creates high-quality interfaces without requiring complex heteroepitaxial processes

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Molecular beam epitaxy is used to precisely control the composition and structure of the Ge layer during growth. By adjusting deposition parameters and doping concentrations, high-quality epitaxial interfaces are achieved with reduced defect densities

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves a stable, coherent superconducting phase in germanium with a critical temperature of 5.27 K and enhanced critical magnetic fields, maintaining the integrity of the Ge lattice and improving film uniformity and conductivity.

Implementation Method 1

co-depositing, on a germanium substrate, a gallium-doped germanium layer

Methodology Applied
Scientific EffectMolecular beam epitaxy: Epitaxy

Implementation Method 2

The co-depositing and depositing can occur by molecular beam epitaxy (MBE)

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 3

After implantation and subsequent flash annealing at high temperature to activate the Ga acceptors

Methodology Applied
Scientific EffectAnnealing: Annealing

Implementation Method 4

The first additional layer can be a capping layer

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS20250347028A1Superconductivity in hyperdoped ge by molecular beam epitaxy
Publication Date: 2025.11.13 NEW YORK UNIV
  • US20250347028A1 patent drawing
  • US20250347028A1 patent drawing
  • US20250347028A1 patent drawing

AI summary

A method can include co-depositing Germanium and Gallium on a Germanium substrate to hyperdope Germanium at room temperature. The method can include depositing Silicon on the Germanium and Gallium to either alloy or cap the Germanium and Gallium. The hyperdoped Germanium can have superconductivity properties.