Hyperelastic Shock Mitigation for Penetrating Weapon Electronics
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Solution Overview
Problem
Electronic components in penetrating weapon systems, such as those used in gun-fired munitions, are prone to damage from mechanical shock, setback acceleration, and pyrotechnic shock, which can prevent proper functioning of the electronics and electro-explosive initiators.
Innovation Solution
A shock mitigation assembly is introduced, comprising a support with an internal spiral flange, an electronics package with an external spiral flange, and hyperelastic material between the support and the electronics package, along with a weight attached to the electronic device to mitigate high-frequency shock forces, and a housing that encloses the electronic subassembly within an enclosed volume filled with hyperelastic material to facilitate reliable initiation and venting of explosive charges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If glass beads or potting material are placed between electronics housing and electronic device to mitigate shock, then shock protection is improved, but reliability of explosive initiation is worsened due to interference at explosive train interface
Solution Approach 1:
The patent applies different materials at different locations: hyperelastic material is used at the electronics housing interface for shock protection, while the explosive train interface is kept clear of such materials to ensure reliable initiation. This local differentiation resolves the contradiction by providing shock mitigation where needed without interfering with explosive function.
Solution Approach 2:
The hyperelastic material acts as an intermediary shock-absorbing layer between the electronics housing and external shock sources, protecting electronic components without being placed at the explosive train interface. This intermediary approach provides shock protection while maintaining explosive initiation reliability.
2Strength
If metal cup and metal housing with metal cover are used to mount electronic device, then mechanical strength is improved, but shock mitigation effectiveness is worsened due to rigid structure transmitting shock
Solution Approach 1:
The patent changes the material parameter from rigid metal to hyperelastic material, which has different mechanical properties including shock-absorbing characteristics. This parameter change allows the housing to maintain strength while simultaneously mitigating shock transmission to electronic components.
3Object-affected harmful factors
If hyperelastic material is placed between housing and electronic subassembly for shock protection, then shock mitigation is improved, but device complexity is worsened due to additional materials and assembly steps
Solution Approach 1:
The hyperelastic material serves multiple functions simultaneously: it provides shock mitigation, acoustic isolation, and environmental sealing. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity despite adding protective capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shock mitigation assembly effectively reduces shock damage to electronic components, ensuring reliable detonation control and increased survivability of electronic devices by over a factor of three, protecting against impact, penetration, and pyrotechnic shocks across varying temperatures.
Implementation Method 1
hyperelastic material between the support and the electronics package, where the hyperelastic material has a modulus of elasticity that has elastic characteristics with shock or temperature
Implementation Method 2
a weight attached to the electronic device to mitigate high frequency shock forces
Data Source
AI summary
A shock mitigation assembly for a penetrating explosive weapon having a first explosive charge and a second explosive charge includes an electronic circuit card having an electronic circuit formed therein, a weight attached to the circuit card to form a circuit card subassembly, a housing enclosing the subassembly, and a hyperelastic material between the housing and the subassembly for internal shock mitigation. The hyperelastic material has a modulus of elasticity that remains elastic characteristics with shock, temperature, or a combination of shock and temperature. The housing may include a casing and a cover with corresponding features that mate with one another and prevent separation of the cover from the casing. The casing also may have an external spiral flange that overlaps an internal spiral flange of a support for the casing, with a hyperelastic material between the casing and support for external shock mitigation.


