Hyperspectral Electrode Surface Analysis for Foreign Substance Quantification
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Solution Overview
Problem
Existing methods for analyzing foreign substances on electrode surfaces during secondary battery manufacturing are limited by the large field of view of conventional vision systems, which can only detect presence or absence but not accurately identify types and amounts, necessitating a more precise analysis method.
Innovation Solution
Employing a hyperspectral CCD to analyze electrode surfaces by calculating a discrimination factor (T A/B ) from the electrode surface spectrum, allowing for precise visualization and quantification of individual regions using Formula 1, distinguishing between different substances on the electrode surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional vision system with large field of view is used for inline electrode manufacturing, then the system can detect the presence or absence of foreign substances, but it cannot accurately identify their types and residual amounts
Solution Approach 1:
The patent divides the electrode surface analysis into multiple regions of interest (ROI) that can be selectively imaged. Instead of attempting to capture the entire electrode surface with a single large FOV camera, the system segments the analysis area and uses multiple smaller FOV images to cover different regions, thereby achieving both high measurement precision and comprehensive coverage
Solution Approach 2:
The patent transitions from 2D imaging to 3D surface mapping by introducing depth information through focus stacking or confocal microscopy techniques. This dimensional enhancement allows the system to distinguish foreign substances based on their height and surface topology in addition to optical properties, significantly improving identification accuracy without requiring a larger FOV
2Measurement precision
If a more precise camera capable of analyzing foreign substances is installed, then foreign substance identification accuracy improves, but device complexity and installation constraints increase
Solution Approach 1:
The patent designs an imaging system that performs multiple functions using a single integrated platform. The same optical system is used for both high-resolution foreign substance detection and quantitative analysis of residual amounts. The system can switch between different analysis modes (presence detection, type identification, quantity measurement) without requiring separate specialized devices, thereby reducing overall system complexity
Solution Approach 2:
The patent introduces advanced image processing algorithms and software analysis tools as intermediaries between the camera and the final results. These computational methods enhance the capabilities of a standard precision camera, allowing it to achieve foreign substance identification and quantification accuracy that would otherwise require much more complex hardware systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise identification of foreign substances and their amounts on the electrode surface, improving process efficiency and product reliability by optimizing the etching process and equipment performance.
Implementation Method 1
photographing an electrode surface with a hyperspectral CCD to obtain a spectrum of the electrode surface
Implementation Method 2
a hyperspectral CCD for photographing an electrode surface to obtain a spectrum of the electrode surface
Data Source
Figure 1a~1b
Figure 1c~2
Figure 3
AI summary
The present disclosure relates to a method and system for analyzing an electrode surface, and more specifically, to a method and system for analyzing an electrode surface that can precisely analyze foreign substances remaining on the electrode surface during an electrode manufacturing process using a hyperspectral CCD to increase process efficiency and product reliability.