Integrated Circuit Adhesive Encapsulation for Chip Carrier Bonding
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Solution Overview
Problem
Current semiconductor chip manufacturing processes face challenges such as sawing through brittle silicon and soft polymer materials, requiring multiple materials and processes that need to be well-integrated, and involving complex material matching for adhesion and encapsulation.
Innovation Solution
An integrated circuit design where a semiconductor chip is partially or completely encapsulated with a thermally and electrically conductive adhesive material that also serves to adhere the chip to a carrier, simplifying the manufacturing process by using a single material for both encapsulation and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple materials (adhesive material, encapsulation material, fixing material) are used in the manufacturing process, then the functionality and reliability of the integrated circuit are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple materials (adhesive material, encapsulation material, and fixing material) into a single integrated encapsulation material that performs all three functions simultaneously. This reduces the number of separate materials and processes required, simplifying manufacturing while maintaining the reliability benefits of adhesion, encapsulation, and mechanical fixing.
Solution Approach 2:
The encapsulation material is designed to serve multiple functions: it acts as an adhesive to bond the chip to the carrier, provides encapsulation to protect the chip, and serves as a fixing material for mechanical support. This multi-functionality reduces the number of separate components and processes needed in the manufacturing system.
2Manufacturing precision
If multiple deposition processes are used to deposit different materials, then the manufacturing precision and material matching are improved, but the productivity and manufacturing time decrease
Solution Approach 1:
The patent merges multiple deposition processes into a single deposition process that deposits the encapsulation material with all required properties (adhesive, encapsulation, and fixing characteristics) in one step. This eliminates the need for sequential deposition of multiple materials, thereby improving manufacturing throughput while maintaining precise material properties.
3Productivity
If sawing is carried out through brittle silicon and soft polymer material, then the chip is separated into individual units, but the manufacturing precision and component integrity deteriorate
Solution Approach 1:
The patent changes the material parameters by using an encapsulation material with optimized mechanical properties that bridges the hardness gap between brittle silicon and soft polymer. This modified material allows for cleaner, more precise sawing operations that maintain chip integrity while still enabling efficient separation into individual units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity of chip manufacturing by eliminating the need to saw through multiple materials, improves component reliability, and minimizes process steps while enhancing thermal conductivity and electrical connectivity.
Implementation Method 1
a carrier adhered to the chip by means of the encapsulation material
Implementation Method 2
encapsulation material covering at least three sides of the chip
Data Source
AI summary
An integrated circuit is provided. The integrated circuit includes: a chip and encapsulation material covering at least three sides of the chip, the encapsulation material being formed from adhesive material. The integrated circuit includes a carrier adhered to the chip by means of the encapsulation material.