IC Antenna Structure for 55-64 GHz On-Chip Wireless Communication
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Solution Overview
Problem
Current wireless communication systems face challenges in integrating efficient antenna structures within the limited space of integrated circuits (ICs), as traditional antennas are too large to be implemented on-chip due to their wavelength requirements, posing a design hurdle for advancing IC fabrication and communication between ICs.
Innovation Solution
The development of integrated circuit antenna structures that utilize electromagnetic properties to operate within frequency bands of 55-64 GHz, allowing for on-chip or on-package substrate implementation, enabling local and remote wireless communications without the need for extensive conductive traces, and supporting multiple simultaneous RF communications through various offset and multiplexing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional antenna structures are used for wireless communication, then communication efficiency is improved, but the antenna size becomes too large to be integrated on-chip
Solution Approach 1:
The patent changes the operating frequency parameter to 55-64 GHz, which reduces the wavelength and consequently the antenna size. By operating at higher frequencies, the antenna can be miniaturized to fit on-chip while maintaining communication efficiency through appropriate frequency band selection
Solution Approach 2:
The patent transitions from traditional planar 2D antenna layouts to 3D立体 antenna structures that utilize vertical stacking and multi-layer configurations. This dimensional change allows the antenna to achieve the required electrical length for efficient radiation while occupying minimal planar area on the chip
2Area of moving object
If antenna size is reduced for on-chip integration, then area is improved, but communication efficiency deteriorates
Solution Approach 1:
The patent employs composite antenna structures combining different conductive materials and substrate materials with optimized electromagnetic properties. This allows the small on-chip antenna to achieve enhanced radiation efficiency and impedance matching despite the size constraint
Solution Approach 2:
The patent implements nested or folded antenna configurations where the antenna trace winds back and forth or stacks in multiple layers, effectively nesting the antenna path within a compact footprint. This maintains the required electrical length for efficient radiation while minimizing the physical area occupied
3Reliability
If extensive conductive traces are used for antenna implementation, then antenna performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the antenna function with existing on-chip interconnect structures and signal lines. By reusing existing conductive layers and traces for dual purposes (signal transmission and antenna radiation), the design achieves good antenna performance without adding separate extensive trace structures, thereby reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient wireless communication by allowing ICs to transmit and receive signals within the desired frequency bands, facilitating advancements in IC fabrication and communication, while reducing the complexity of communication paths between ICs and eliminating the need for extensive conductive traces.
Implementation Method 1
antenna structure that includes an antenna, a transmission line, and an impedance matching circuit... operate within frequency bands of 55-64 GHz
Data Source
AI summary
An integrated circuit (IC) antenna structure includes a die, a package substrate, an antenna element, a ground plane, and a transmission line. The antenna element is on the die and/or package substrate and has a length in the range of approximately 1¼ millimeters to 2½ millimeters. The ground plane has a surface area larger than a surface area of the antenna element. The transmission line is on the die and/or the package substrate and includes a first line and a second line, wherein at least the first line is electrically coupled to the antenna element.