Predicting Atmospheric Upsets in Integrated Circuits via Beam Surrogates
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Solution Overview
Problem
Integrated circuits (ICs) face reliability issues due to atmospheric upsets caused by cosmic radiation, which can lead to temporary operational disruptions and delay the generation of accurate reliability specifications due to the time required to collect statistically significant data on upset events.
Innovation Solution
A method and system for concurrently measuring and predicting the rate of atmospheric upsets in ICs by comparing the rates of beam upsets in different types of ICs exposed to a beam of atomic particles, allowing for the determination of relative susceptibility and prediction of upset rates without the need for separate tests or extensive data collection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate atmospheric upset tests are conducted for each IC type to obtain accurate reliability specifications, then measurement precision is improved, but loss of time increases due to the need to collect statistically significant data for each IC type individually
Solution Approach 1:
The patent uses beam upset tests as a copy or surrogate for atmospheric upset tests. By measuring upset rates in a controlled particle beam environment, the method obtains reliability data without requiring lengthy atmospheric exposure tests. The beam test results are then used to predict atmospheric upset rates, achieving accurate reliability specifications in a fraction of the time.
Solution Approach 2:
The patent introduces a particle beam as an intermediary between the IC device and direct atmospheric upset measurement. The beam serves as a mediator that accelerates the upset generation process, allowing statistically significant data to be collected rapidly in a controlled environment rather than waiting for natural atmospheric upsets to occur over extended periods.
2Reliability
If design alternatives are evaluated to achieve target reliability, then reliability is improved, but device complexity increases due to multiple design considerations
Solution Approach 1:
The patent changes the measurement parameter from direct atmospheric upset rate to beam upset rate ratio. By measuring the ratio of beam upset rates between different IC types and applying this ratio to known atmospheric upset rates, the method enables reliable comparison of design alternatives without requiring complex atmospheric testing for each variant. This simplifies the evaluation process while maintaining reliability assessment accuracy.
3Measurement precision
If atmospheric upset rates are measured directly for new IC types, then measurement precision is improved, but productivity decreases due to the time required for data collection
Solution Approach 1:
The patent performs preliminary beam upset testing on new IC types to establish their relative susceptibility compared to reference IC types. This preliminary action in a controlled beam environment provides the data needed to quickly predict atmospheric upset rates without requiring lengthy direct atmospheric testing, thereby maintaining measurement precision while dramatically improving productivity in generating reliability specifications.
Data Source
AI summary
Prediction of a rate of atmospheric upsets in an integrated circuit (IC) is described. In one embodiment, a first rate of atmospheric upsets is measured in a plurality of ICs of a first type. Within a beam of atomic particles, a second rate of beam upsets of at least one IC of the first type and a third rate of beam upsets of at least one IC of a second type are concurrently measured. A fourth rate of atmospheric upsets is determined in an IC of the second type as a function of the first rate of atmospheric upsets and the second and third rates of beam upsets.