Backside Power Rail IC Architecture for Parallel Power Gating

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Solution Overview

Problem

As semiconductor integrated circuits (ICs) become smaller and more complex, they face challenges with reduced operating voltages and increased power consumption due to resistance, necessitating efficient power management techniques to improve performance and efficiency.

Innovation Solution

The implementation of a header circuit coupled with gated and ungated power circuits, utilizing multiple power rails and transistors to manage voltage supply and control power states, thereby reducing resistance and power consumption by routing power in a parallel manner across the IC.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If ICs become smaller and more complex, then integration density is improved, but operating voltage is reduced and power consumption increases

Engineering Contradiction:
Improveintegration densityVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The power supply network is segmented into multiple independent power rails (first power rail, second power rail, third power rail) that can be independently controlled. This segmentation allows different circuits to receive different voltages and enables selective power gating to reduce overall power consumption while maintaining high integration density.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements dynamic power management through controllable switches that can adjust power supply states in real-time. The header circuit and power gating circuits dynamically control the connection between power rails and circuits based on operational requirements, enabling adaptive power reduction without sacrificing integration density.

Inventive Principle:
Principle #15Dynamics

2Use of energy by moving object

If power gating is implemented, then power consumption is reduced, but circuit complexity increases

Engineering Contradiction:
Improvepower consumptionVSAvoidcircuit complexity
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The header circuit serves multiple functions: it distributes power to multiple power rails, controls power gating operations, and manages voltage supply to different circuits. This multi-functionality reduces the need for separate control circuits, thereby limiting the increase in circuit complexity while achieving power consumption reduction.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the power distribution function and power gating control function into a unified power supply network architecture. Multiple power rails are combined with integrated control switches, creating a consolidated structure that reduces overall circuit complexity compared to having separate independent power gating circuits for each rail.

Inventive Principle:
Principle #5Merging (Combining)

3Productivity

If multiple power rails are used, then power distribution efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvepower distribution efficiencyVSAvoidmanufacturing complexity
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent extends the power distribution network into the vertical dimension by implementing power rails on both the front side and back side of the substrate. This three-dimensional power rail arrangement improves power distribution efficiency by providing multiple parallel paths while utilizing the substrate thickness dimension, thereby limiting the increase in manufacturing complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12033998B2Integrated circuit and method of forming the same
Publication Date: 2024.07.09 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12033998B2 patent drawing
  • US12033998B2 patent drawing
  • US12033998B2 patent drawing

AI summary

An integrated circuit includes a gated circuit configured to operate on at least a first or a second voltage, a header circuit coupled to the gated circuit, a first and second power rail on a back-side of a wafer, and a third power rail on a front-side of the wafer. The header circuit is configured to supply the first voltage to the gated circuit by the first power rail. The first power rail includes a first portion, a second portion and a third portion, the third portion being between the first portion and the second portion. The second power rail is configured to supply the second voltage to the gated circuit, and is between the first portion and the second portion. The third power rail includes a first set of conductors. Each of the first set of conductors being configured to supply a third voltage to the header circuit.