IC Backside Shielding Structure Against Imaging and Access
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Solution Overview
Problem
Integrated circuits (ICs) are vulnerable to imaging and access by adverse entities, which can reverse-engineer the ICs to replicate valuable intellectual property, and existing security measures are inadequate against semi-invasive techniques like electromagnetic radiation probing.
Innovation Solution
Implementing an electromagnetic radiation blocking layer on the backside of a semiconductor substrate, which is bonded to a support substrate, making it difficult for adversaries to access the IC's physical features or data without compromising the structural integrity of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electromagnetic radiation blocking layer is implemented on the backside of a semiconductor substrate, then imaging and access to the circuit is prevented, but the substrate becomes more fragile and prone to breakage
Solution Approach 1:
A support substrate is introduced as an intermediary element bonded to the semiconductor substrate. This support substrate acts as a mediator that provides mechanical strength and structural integrity to the fragile semiconductor substrate containing the electromagnetic radiation blocking layer, allowing the blocking layer to function without compromising the overall structural strength
Solution Approach 2:
The invention creates a composite structure by bonding the semiconductor substrate (containing the circuit and electromagnetic radiation blocking layer) to a support substrate. This composite construction combines the electromagnetic radiation blocking properties of the first substrate with the mechanical strength of the support substrate, achieving both protection and structural integrity
2Ease of manufacture
If the semiconductor substrate is thinned from the backside to facilitate bonding, then bonding to the support substrate is enabled, but the substrate becomes more vulnerable to damage
Solution Approach 1:
The semiconductor substrate is thinned in advance before bonding to the support substrate. This preliminary thinning action facilitates easier and more effective bonding by reducing the thickness that needs to be bonded, while the subsequent bonding to the support substrate compensates for the reduced thickness by providing external structural support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electromagnetic radiation blocking layer effectively prevents imaging and access to the IC's circuitry and data, rendering reverse-engineering attempts futile by making the substrate fragile and prone to breakage, thus safeguarding the IC's intellectual property.
Implementation Method 1
An electromagnetic radiation blocking layer is disposed on a backside of the semiconductor substrate... The electromagnetic radiation blocking layer can prevent imaging or accessing of the circuit from the backside of the semiconductor substrate
Data Source
AI summary
Some examples described herein relate to protecting an integrated circuit (IC) structure from imaging or access. In an example, an IC structure includes a semiconductor substrate, an electromagnetic radiation blocking layer, and a support substrate. The semiconductor substrate has a circuit disposed on a front side of the semiconductor substrate. The electromagnetic radiation blocking layer is disposed on a backside of the semiconductor substrate opposite from the front side of the semiconductor substrate. The support substrate is bonded to the semiconductor substrate. The electromagnetic radiation blocking layer is disposed between the semiconductor substrate and the support substrate.