IC Ball Break Detection Using ESD Protection Circuit
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Solution Overview
Problem
Existing methods for detecting breakages in IC bonds, particularly in mm-wavelength systems, are unreliable due to capacitive coupling effects, which can lead to false negatives or false positives in safety-critical systems like car-radar modules, and are inefficient in terms of size and power dissipation, especially when using directional couplers and multiple power sensors.
Innovation Solution
A testing circuit that uses a current source to inject a DC current through an on-chip ESD protection circuit and a shunt path to determine if the connection presents a short circuit, leveraging the properties of ESD protection circuits to differentiate between open and closed circuits, effectively detecting ball breakages without interfering with signal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If directional couplers and multiple power sensors are used for ball break detection, then detection capability is provided, but device complexity and power dissipation increase
Solution Approach 1:
The patent extracts the detection function from complex external test equipment and implements it directly within the IC using existing ESD protection structures. By taking out the detection capability from separate power sensors and directional couplers and embedding it in the ESD circuit, the solution reduces device complexity while maintaining detection reliability.
Solution Approach 2:
The ESD protection circuit is made multi-functional by enabling it to serve both its original protection purpose and the new ball break detection function. This universality eliminates the need for separate dedicated detection circuits, thereby reducing overall device complexity and component count.
2Reliability
If directional couplers and multiple power sensors are used for ball break detection, then detection capability is provided, but power dissipation increases
Solution Approach 1:
The ESD protection circuit is made multi-functional by enabling it to serve both its original protection purpose and the new ball break detection function. This universality eliminates the need for separate dedicated detection circuits, thereby reducing overall device complexity and component count.
Solution Approach 2:
The ESD protection circuit performs self-diagnosis by monitoring its own operational state. When a ball break occurs, the ESD circuit's ability to shunt voltage changes, and this self-generated signal is used to detect the fault without requiring additional power-consuming external test equipment.
3Device complexity
If ESD protection circuit is used for ball break detection, then size and power dissipation are reduced, but detection reliability must be maintained
Solution Approach 1:
The circuit implements feedback by continuously monitoring the voltage at the ESD protection node. The testing unit detects changes in voltage levels that indicate ball breakage, providing real-time feedback on connection integrity. This feedback mechanism ensures reliable detection while using the compact ESD circuit structure.
Solution Approach 2:
The ESD protection circuit is pre-configured with test nodes and voltage reference levels that enable detection functionality before actual operation. The preliminary setup of voltage dividers and reference voltages allows the circuit to immediately detect ball breaks without requiring additional setup or calibration steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides reliable detection of IC bond breakages with reduced size and power dissipation, suitable for mm-wavelength frequencies, and can be applied to both transmitter and receiver circuits without adding noise, ensuring functional safety in systems like autonomous emergency braking systems.
Implementation Method 1
an on-chip ESD protection circuit which provides a path between one side of the connection to be tested and a fixed voltage line
Data Source
AI summary
The invention provides a testing circuit for testing a connection between a chip and external circuitry. A current source is used to inject a DC current towards the connection to be tested from the chip side. On-chip ESD protection is provided giving a path between the connection to be tested and a fixed voltage line. A shunt path is also coupled to the connection to be tested on the external circuitry side. It is determined if the current source current flows through the ESD protection circuit, and this can be used to determine whether or not the connection to be tested presents an open circuit for the DC test current.