IC Baseline Die Temperature Capture via Reset Signal
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Solution Overview
Problem
Integrated circuits face inaccurate temperature calibration due to self-heating issues during deployment, as disabling power supplies and internal heating components is not feasible in mission mode, leading to inaccurate temperature readings compared to reference temperatures.
Innovation Solution
The integrated circuit employs self-initializing logic that captures baseline die temperature data by asserting and deasserting a reset signal after power application, allowing temperature data to be obtained before significant self-heating occurs, and stores this data for accurate calibration and thermal path integrity assessment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If power supplies and internal self-heating components are disabled during calibration, then temperature measurement accuracy is improved, but the IC cannot function in mission mode
Solution Approach 1:
The patent captures baseline temperature data during the reset period, before self-heating components are activated. This preliminary capture of temperature information occurs at a time when the die temperature is closest to the reference temperature, enabling accurate calibration without requiring the IC to remain in a non-functional state for extended periods.
Solution Approach 2:
The patent dynamically controls the timing of temperature data capture relative to the reset signal. The baseline temperature is captured during the reset assertion period when heating components are off, then the system transitions to mission mode with heating components enabled. This dynamic timing adjustment allows the system to adapt between calibration and operational states.
2Adaptability or versatility
If self-heating components are enabled during calibration, then mission mode functionality is maintained, but temperature calibration accuracy deteriorates
Solution Approach 1:
The system performs the critical temperature measurement action before self-heating occurs. By capturing the baseline temperature during the reset period when heating components are disabled, the system obtains accurate reference data without needing to maintain disabled heating components throughout the entire calibration process.
Solution Approach 2:
The IC performs self-calibration by capturing its own baseline temperature data internally during the reset period. This self-service approach eliminates the need for external intervention or prolonged disabling of heating components, allowing the IC to calibrate itself quickly and transition to mission mode.
3Ease of operation
If baseline temperature data is captured after reset signal deassertion, then normal operation begins, but self-heating causes temperature drift from reference temperature
Solution Approach 1:
The patent captures the baseline temperature data during the reset assertion period, which is before normal operation begins. This preliminary capture ensures that the temperature measurement occurs when the die is still at or near the reference temperature, before self-heating from normal operation causes temperature drift.
Solution Approach 2:
The system rushes through the temperature capture process during the brief reset period, obtaining the baseline data quickly before the thermal conditions change. This rapid capture during the transition period avoids the temperature drift that would occur if measurement were delayed until normal operation is fully established.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate baseline temperature data capture before self-heating begins, ensuring reliable temperature calibration and thermal path assessment without requiring external intervention, thus improving the accuracy and reliability of temperature monitoring in integrated circuits.
Implementation Method 1
a thermal sensing device located at a location on the IC die
Data Source
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AI summary
A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.