Integrated Circuit Block Identification Without Extra Bus Wires
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Solution Overview
Problem
Current methods for determining the number of stitched computer chips on silicon wafers require additional bus wires and complex circuitry, increasing wafer space and complexity.
Innovation Solution
The implementation of identification blocks within integrated circuit blocks that generate outputs based on previous block inputs and increment values, allowing for communication signals to be sent to a controller without additional circuitry, thereby reducing the need for multiple bus wires and wafer space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pads are bonded externally to each die with bus wires to determine the number of stitched dice, then the number of stitched dice can be determined, but the wafer space increases and circuitry complexity increases
Solution Approach 1:
The patent extracts the identification function from external pads and bus wires, and embeds it directly into the integrated circuit blocks themselves. Each IC block contains an identification block that generates unique identifiers internally, eliminating the need for external identification infrastructure.
Solution Approach 2:
Each integrated circuit block is self-sufficient in generating its own unique identifier through its internal identification block. The identification block within each IC block autonomously produces identifying signals based on its position and the increment value, without requiring external pads or bus wires for identification purposes.
2Measurement precision
If pads are bonded externally to each die with bus wires to determine the number of stitched dice, then the number of stitched dice can be determined, but the wafer space increases
Solution Approach 1:
The patent merges the identification function with the integrated circuit blocks themselves. The identification block is integrated within each IC block, combining the functional circuitry with the identification capability, thereby eliminating separate pads and bus wires that would consume additional wafer space.
Solution Approach 2:
The patent removes the external identification infrastructure (pads and bus wires) and extracts the identification capability into the core IC blocks, significantly reducing the space required for identification purposes on the wafer.
3Measurement precision
If additional bus wires are used for each die to communicate with controllers, then the number of stitched dice can be determined, but the circuitry complexity increases
Solution Approach 1:
The identification block serves multiple functions: it generates unique identifiers for each IC block, enables determination of the number of stitched dice, and provides addressing information for controller communication. This multi-functionality eliminates the need for separate dedicated identification circuitry and bus wires.
Solution Approach 2:
Each IC block's identification block autonomously generates its unique identifier and communicates it to the controller through existing communication channels, eliminating the need for additional dedicated bus wires for identification purposes.
Data Source
AI summary
Methods and systems for digitally decoding integrated circuit blocks are provided. A method for decoding integrated circuit blocks may include providing a previous block output and an increment value input to a first identification block of a first integrated circuit block, providing the output of the first identification t block and the increment value input to one of a plurality of intermediate identification blocks, and providing an output of the last of the plurality of intermediate identification blocks and the increment value input to a last identification block, wherein the output of the last identification block is indicative of the number of integrated circuit blocks.