IC Output Connectivity Error Detection Through Bond Wire Feedback
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Solution Overview
Problem
Integrated circuits face challenges in detecting breaks in bond wires and solder connections, especially when the signal is an output signal, which is difficult to detect and can compromise safety in industries with stringent standards like the automotive industry.
Innovation Solution
Incorporating a circuit with an input and output circuit, where a first wire is coupled between the output circuit and a lead, and a second wire is coupled between the lead and the input circuit, allowing the input circuit to receive the signal after it has been transmitted across both wires, enabling detection of breaks through signal comparison.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond wires and solder connections are used to connect the semiconductor die to external circuits, then electrical connectivity is achieved, but breaks in these connections become difficult to detect especially for output signals
Solution Approach 1:
The patent implements preliminary error detection by incorporating a detection circuit that continuously monitors bond wire connections before they cause system failure. The detection circuit proactively identifies breaks in bond wires by comparing expected signal patterns with actual received signals, allowing the system to detect connection failures before they affect normal operation.
Solution Approach 2:
The patent employs feedback mechanisms where the detection circuit receives feedback signals from the bond wires and compares them against reference signals. When a discrepancy is detected indicating a bond wire break, the feedback loop triggers an error indication to notify the system of the connection failure, enabling continuous monitoring and immediate detection of connectivity issues.
2Reliability
If robust error detection is implemented to meet safety standards, then detection capability is improved, but device complexity increases
Solution Approach 1:
The patent segments the detection function into separate dedicated detection circuits for different signal types (input signals, output signals, and internal signals). This segmentation allows each detection circuit to be optimized for its specific function while keeping the overall complexity manageable through modular design, where each segment handles a specific aspect of error detection independently.
Solution Approach 2:
The detection circuit is designed with multi-functionality to detect various types of errors including bond wire breaks, solder connection failures, and signal integrity issues across different signal paths. By creating a universal detection mechanism that can handle multiple detection scenarios through configurable comparison logic, the patent reduces overall device complexity compared to implementing separate dedicated circuits for each detection type.
Data Source
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AI summary
An integrated circuit with transmission line error detection comprises a substrate (202), a package (218) enclosing the substrate, a lead (212) extending from the inside of the package to the outside of the package, and a circuit supported by the substrate. The circuit includes an input circuit (224) and an output circuit (204). A first wire (217) is coupled between the output circuit and the lead and a second wire (228) is coupled between the lead and the input circuit so that the input circuit receives a signal generated by the output circuit after the signal has been transmitted across the first and second wires.