IC Bonding Structure With Expanding Pads for Alignment Tolerance

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Solution Overview

Problem

In the manufacturing of integrated circuits, poor alignment between stacked substrates can lead to conductivity defects due to inadequate coupling of conductive portions, which is inefficient to correct without significantly increasing process time.

Innovation Solution

The use of expanding pads with increased contact areas on conductive portions, combined with aluminum fluoride barrier layers to reduce corrosion and enhance conductivity, allows for reliable bonding even with imperfect alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If perfect alignment is pursued during semiconductor manufacturing, then alignment precision is improved, but process time increases significantly

Engineering Contradiction:

Improvealignment precisionVSAvoidprocess time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent changes the geometric parameters of the bonding interface by introducing expanding pads that increase the contact area during bonding. This parameter change allows the bonding process to be more tolerant of alignment variations, enabling acceptable bonding results without requiring perfect alignment and thus reducing process time while maintaining sufficient manufacturing precision

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The expanding pads serve as a preliminary compensatory structure that anticipates potential alignment errors. By designing the bonding interface with expanded contact areas beforehand, the structure provides a cushion against misalignment, allowing the bonding process to succeed even when perfect alignment is not achieved, thereby reducing the need for time-consuming alignment corrections

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If expanding pads with increased contact areas are used, then bonding reliability is improved, but device structure becomes more complex

Engineering Contradiction:

Improvebonding reliabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The expanding pads are merged with the existing conductive portions and barrier layers to form an integrated bonding structure. Rather than adding completely separate components, the design combines the expanding pad formation with the existing metallization layers, achieving enhanced bonding reliability while minimizing the increase in structural complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The expanding pads serve multiple functions: they increase contact area for improved bonding reliability, provide corrosion protection through the barrier layer, and enable tolerance to alignment errors. This multi-functionality achieves reliable bonding without proportionally increasing structural complexity, as the same structure accomplishes multiple objectives

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If aluminum fluoride barrier layers are used, then corrosion resistance is improved, but manufacturing process becomes more complex

Engineering Contradiction:

Improvecorrosion resistanceVSAvoidmanufacturing process complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent changes the material parameter of the barrier layer by selecting aluminum fluoride, which provides superior corrosion resistance compared to conventional barrier materials. This material parameter change enhances protection against harmful factors while the deposition process integrates with existing semiconductor manufacturing techniques, limiting the increase in manufacturing process complexity

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach alleviates conductivity issues caused by poor alignment and improves the reliability of integrated circuit devices by increasing contact areas and preventing corrosion, thus enabling efficient and accurate bonding processes.

Implementation Method 1

The first barrier layer and the second barrier layer include aluminum fluoride

Methodology Applied

Scientific EffectCorrosion resistance:

Implementation Method 2

a first expanding pad arranged on the first conductive portion and including a first contact area greater than that of the first conductive portion

Methodology Applied

Scientific EffectContact area expansion:

Data Source

PatentUS12159831B2Method of manufacturing integrated circuit device with bonding structure

Publication Date: 2024.12.03 NAN YA TECH

AI summary

A circuit device includes: a first substrate having a first barrier layer; a second substrate having a second barrier layer; a first conductive portion arranged over the first barrier layer; a second conductive portion arranged over the second barrier layer; a first expanding pad arranged on the first conductive portion and including a first contact area greater than that of the first conductive portion; and a second expanding pad bonded to the first expanding pad, arranged on the second conductive portion and including a second expanded contact area greater than that of the second conductive portion. The first barrier layer and the second barrier layer include aluminum fluoride.