IC Broken Connection Detection via Capacitance Sensing
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Solution Overview
Problem
Existing methods for ensuring reliable connections in integrated circuit devices, such as redundant connections and repeated data transmission, are either costly or increase signaling complexity, and require specific hardware or protocols, making them undesirable for safety devices.
Innovation Solution
The use of pull up and pull down circuits with sensing elements to detect changes in capacitance within the external signal path, allowing for the identification of broken connections without increasing the number of input/output pads or requiring additional hardware, by selectively coupling resistors to the signal path and measuring voltage changes over time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redundant connections are used to ensure connection reliability, then reliability is improved, but device complexity increases due to doubled input/output pads/contacts
Solution Approach 1:
The patent replaces physical redundant connections with an electrical field-based detection mechanism. A sensing element measures electrical characteristics (capacitance, impedance, or time constants) of the signal path to detect broken connections, eliminating the need for duplicate physical connections while maintaining reliability detection capability
Solution Approach 2:
The patent introduces an intermediary sensing element that indirectly detects connection integrity by measuring electrical characteristics of the signal path. This intermediary approach allows detection of broken connections without requiring direct redundant physical paths, reducing the number of pads/contacts needed
2Reliability
If data signals are transmitted twice and compared to identify broken connections, then reliability is improved, but device complexity increases due to increased signaling complexity
Solution Approach 1:
The patent substitutes complex signal transmission and comparison protocols with a simpler electrical measurement approach. Instead of transmitting data signals multiple times and comparing them, the sensing element directly measures electrical characteristics to detect connection breaks, significantly reducing signaling complexity
Solution Approach 2:
The patent creates an electrical copy or model of the signal path's electrical characteristics through the sensing element. By measuring the electrical characteristics (capacitance, impedance, time constants) of the existing signal path, the system can detect broken connections without needing to replicate or retransmit actual data signals
3Reliability
If external hardware is used to determine connection reliability, then reliability is improved, but device complexity increases due to additional external components
Solution Approach 1:
The patent merges the connection detection functionality into the existing IC device by integrating a sensing element within the semiconductor die. This eliminates the need for separate external detection hardware, reducing the number of external components while maintaining the ability to detect broken connections
Solution Approach 2:
The IC device performs self-diagnosis of its own connection integrity by incorporating a sensing element that can autonomously measure electrical characteristics of its signal paths. The device monitors its own health without requiring external observation hardware, enabling self-service reliability verification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for non-intrusive identification of broken connections, maintaining signal integrity and reducing costs by not affecting the logical state of the signal path, thus ensuring reliable connections without the need for redundant hardware or complex protocols.
Implementation Method 1
detect changes in capacitance within the signal path by selectively coupling resistors to the path and measuring voltage changes over time
Data Source
AI summary
An integrated circuit device comprises at least one connectivity identification module. The at least one connectivity identification module is arranged to determine an initial sensed state of at least one external signal path of the integrated circuit device, cause the at least one external signal path to be pulled towards an opposing state to the initial sensed state therefor, determine a new sensed state of the at least one external signal path of the integrated circuit device, and identify a presence of a broken connection within the at least one external signal path, if the new sensed state of the at least one external signal path does not match the initial sensed state of the at least one external signal path.