Integrated Circuit Bump Pad for Multiple Packaging Types
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Solution Overview
Problem
The existing manufacturing process for integrated circuits requires multiple masks and complex inventory management due to the need for different packaging types, leading to increased costs and complexity in producing functionally identical ICs with varying packaging configurations.
Innovation Solution
A structure and method that allows for multiple packaging options using a single design, featuring a bump pad with electrically disconnected sections and conductive traces connecting bond pads to bump pads, enabling either wire bond or ball bond packaging by attaching a solder ball or wire bond, respectively, without additional masks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different masks are used to produce different packaging versions of ICs, then packaging type diversity is achieved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent implements a universal pad layout that can serve multiple packaging functions. The uppermost level of metallization uses a single mask pattern that accommodates both wire bond and ball bond configurations through selective bonding processes, eliminating the need for separate masks for different packaging types.
Solution Approach 2:
The patent prepares the IC surface in advance with a universal pad structure that can accommodate different bonding methods. By pre-configuring the metallization layer with a single mask that includes both wire bond pads and ball bond pads in the same layout, the system enables later-stage packaging selection without requiring preliminary packaging-specific mask applications.
2Adaptability or versatility
If multiple masks are used for different packaging versions, then packaging flexibility is improved, but the number of manufacturing steps increases
Solution Approach 1:
A single multi-functional mask is designed that defines both wire bond pads and ball bond pads within the same metallization layer. This universal mask enables the production of ICs that can be subsequently packaged using either wire bonding or ball bonding methods, consolidating what would traditionally require multiple separate masking operations into one step.
3Reliability
If different pad configurations are used for wire bonding and ball bonding, then packaging-specific performance is optimized, but inventory management complexity increases
Solution Approach 1:
The patent applies local quality by creating distinct pad regions within the same metallization layer - some areas are optimized for wire bonding with appropriate pad shapes and spacing, while other areas are optimized for ball bonding with different geometries. Each region maintains its packaging-specific characteristics while being part of a unified mask pattern, allowing selective activation based on the desired packaging type.
Data Source
AI summary
Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting a packaging type for an integrated circuit. A structure generally includes a bump pad having a plurality of electrically disconnected bump pad sections, a plurality of bond pads each configured for electrical connection to one of the bump pad sections, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the one bump pad section. A method generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. Another method generally includes forming the uppermost metal layer, and forming either a wire bond to at least one of the bond pads, or a ball bond or solder ball to electrically connect the bump pad section.