IC Card Antenna Circuit with Inclined Insulating Layer
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Solution Overview
Problem
Conventional methods for manufacturing antenna circuit constituent bodies for IC cards/tags result in high environmental load due to excessive metal foil waste and reliability issues such as cracks in the jumper circuit pattern layer, leading to disconnection and reduced productivity.
Innovation Solution
An antenna circuit constituent body with a base material of resin film, featuring an antenna circuit pattern layer with a first and second circuit pattern layer part connected by a third layer part, an insulating layer with inclined surfaces, and a conductive layer formed on the insulating layer to ensure electrical connection without the need for separate etching of metal foil on the opposite surface, reducing environmental impact and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bridge circuit pattern layer is formed on the opposite surface of the base material and connected through through-holes filled with plating material, then electrical connection between antenna circuit and bridge circuit is achieved, but the device complexity and manufacturing steps are increased
Solution Approach 1:
The invention extracts and eliminates the bridge circuit pattern layer from the opposite surface of the base material. Instead of forming a separate bridge circuit pattern layer and connecting it through through-holes, the antenna circuit pattern layer is directly extended to form the bridge circuit function, thereby removing unnecessary structural complexity while maintaining electrical connection reliability
Solution Approach 2:
The invention merges the antenna circuit pattern layer with the bridge circuit function by directly extending the pattern layer across the base material. This integration eliminates the need for separate bridge circuit pattern layers and through-hole connections, simplifying the overall structure while ensuring reliable electrical connection
2Ease of manufacture
If metal foil is subjected to etching processing to form the antenna circuit pattern layer, then the circuit pattern is created, but metal foil waste is generated increasing environmental load
Solution Approach 1:
The invention changes the formation method of the circuit pattern layer from traditional etching of metal foil to direct lamination of pre-patterned metal foil. This parameter change in the manufacturing process eliminates the need for etching chemicals and reduces metal foil waste, thereby decreasing environmental load while maintaining ease of manufacture
Solution Approach 2:
The invention replaces the chemical etching process with a mechanical lamination process where pre-patterned metal foil is directly bonded to the base material. This substitution eliminates harmful chemicals and reduces material waste, addressing environmental concerns while preserving manufacturing efficiency
3Area of stationary object
If the insulating layer has a steep end surface for compact design, then space is saved, but cracks occur in the conductive layer leading to disconnection
Solution Approach 1:
The invention applies curvature to the end surface of the insulating layer by forming an inclined surface instead of a steep vertical edge. This curved transition reduces stress concentration and prevents cracks in the conductive layer, thereby maintaining connection reliability while preserving compact space utilization
Solution Approach 2:
The invention provides beforehand cushioning by forming an inclined surface at the end of the insulating layer that gradually transitions in height. This gradual transition acts as a cushion against stress concentration, preventing crack formation in the conductive layer before they can occur during handling or operation
Data Source
AI summary
Provided are an antenna circuit constituent body for an IC card/tag capable of reducing environmental load in a manufacturing process for joining both end portions of an antenna circuit pattern layer and capable of enhancing reliability of joined portions of the both end portions of the antenna circuit pattern layer: and a method for manufacturing the antenna circuit constituent body for an IC card/tag. In the antenna circuit constituent body for an IC card/tag, an insulating layer (107) is formed so as to extend from an upper part of a first circuit pattern layer part (103), via an upper part of a third circuit pattern layer part (101), and to an upper part of a second circuit pattern layer part (104). A conductive layer (108) is formed on the insulating layer (107) so as to bring the first circuit pattern layer part (103) and the second circuit pattern layer part (104) into conduction. The insulating layer (107) has a plurality of inclined end surfaces on each of the first circuit pattern layer part (103) and the second circuit pattern layer part (104).