IC Card Bevel and Break-off Line Design for Manual Separation
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Solution Overview
Problem
The existing manufacturing methods for IC cards, such as SIM cards, face difficulties in separating the IC card from the card body due to their small size, making it challenging for users to do so by hand.
Innovation Solution
A card body design featuring a card part with a bevel and a bracket part that includes first and second bridge parts and break-off lines, where the first break-off line is deeper and positioned closer to the bevel, allowing for easier manual separation by forming a larger hole area adjacent to the bevel, facilitating user separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the IC card size is reduced to SIM card dimensions, then the IC card portability and integration are improved, but the ease of manual separation from the card body deteriorates
Solution Approach 1:
The card body is divided into multiple segments: a card part, a bracket part, and intermediate bridge parts connecting them. The bridge parts are further segmented with break-off lines at different thicknesses, creating distinct separation zones that enable manual detachment despite the small IC card size.
Solution Approach 2:
Break-off lines are pre-formed at specific locations on the bridge parts during manufacturing, with varying thicknesses designed to facilitate sequential breaking. This preliminary preparation allows users to easily separate the IC card by applying force at the thinnest break-off line without requiring complex tools or techniques.
2Stability of the object's composition
If multiple bridge parts are added to connect the card part and bracket part, then the structural stability is improved, but the device complexity increases
Solution Approach 1:
The connection structure is segmented into multiple bridge parts, each with controlled thickness and break-off lines. This segmentation provides stable support while creating predetermined weak points that simplify separation, balancing stability with ease of disassembly.
Solution Approach 2:
Different regions of the bridge parts have different thicknesses (first thickness at first break-off line, second thickness at second break-off line). This local variation in quality creates zones with different mechanical strengths, enabling stable connection during use while facilitating controlled breaking at specific locations when separation is needed.
Data Source
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AI summary
According to one embodiment, a card body (10) includes a card part (11) onto which an IC module (21) is to be mounted, and a bracket part (18) to support the card part. The card part (11) includes a bevel (17). The bracket part (18) includes a hole (12), a first bridge part (13), a second bridge part (15), a first break-off line (14), and a second break-off line (16). The hole (12) is formed at a circumference of the card part. The first bridge part (13) connects the bracket part and the card part. The second bridge part (15) connects the bracket part (18) and the card part (11) . The second bridge part (15) is provided at a position further away from the bevel (17) than the first bridge part (13) . The first break-off line (14) is provided with a first depth at the first bridge part (13). The second break-off line (16) is provided with a second depth at the second bridge part (15). The second depth is shallower than the first depth.