Metal IC Card Module Support for Stable Coil Resonance
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Solution Overview
Problem
The proximity of an IC module to a metal member in an IC card causes the self-resonant frequency of the coupling coil to increase beyond its design value, disrupting magnetic coupling with the antenna coil.
Innovation Solution
Incorporating a support member made of a magnetic material within the through hole of the metal plate, which supports the IC module and adjusts the self-resonant frequency by allowing magnetic flux to pass through a cavity, thereby reducing the self-resonant frequency of the coupling coil.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the IC module is placed close to the metal plate, then the device structure is compact, but the self-resonant frequency of the coupling coil increases beyond design values
Solution Approach 1:
A magnetic support member is introduced as an intermediary between the metal plate and the IC module. This support member has a cavity that allows magnetic flux to pass through, enabling the coupling coil to maintain its designed self-resonant frequency even when positioned close to the metal plate. The magnetic material in the support member mediates the magnetic field interaction, preventing frequency deviation while maintaining compact device structure.
2Volume of moving object
If the IC module is positioned close to the metal plate, then space utilization is improved, but magnetic coupling with the antenna coil is disrupted
Solution Approach 1:
The magnetic support member serves as a mediator that enables reliable magnetic coupling between the coupling coil and the antenna coil. The cavity in the support member allows magnetic flux to pass through, ensuring that the magnetic field can effectively couple the coils even when the IC module is positioned close to the metal plate, thus maintaining space utilization while ensuring coupling reliability.
3Manufacturing precision
If a non-magnetic support structure is used, then the self-resonant frequency remains stable, but the IC module cannot be securely positioned within the through hole
Solution Approach 1:
The support member is made of magnetic material with specific magnetic properties that allow it to interact with the magnetic field from the antenna coil. This magnetic interaction provides secure positioning of the IC module within the through hole while the cavity structure maintains the self-resonant frequency stability by allowing magnetic flux to pass through.
4Length of moving object
If the coupling coil is positioned close to the metal plate, then device thickness is reduced, but the self-resonant frequency deviates from design values
Solution Approach 1:
The magnetic support member with cavity acts as a mediator that enables the coupling coil to be positioned close to the metal plate (reducing device thickness) while maintaining the designed self-resonant frequency. The magnetic material and cavity structure work together to control the magnetic flux path, preventing frequency deviation despite the reduced distance to the metal plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes the IC module's position and reduces the self-resonant frequency to match design values, enabling effective magnetic coupling and communication with external devices.
Implementation Method 1
the support member made of a magnetic material and has a cavity penetrating therethrough in a thickness direction and accommodating a part of the IC module
Data Source
AI summary
An IC card includes a metal plate having a through hole penetrating therethrough in one direction, a support member disposed inside the through hole and made of a magnetic material, and an IC module supported inside the through hole by the support member. The IC module has a coupling coil. The support member has a cavity penetrating therethrough in the one direction and accommodating a part of the IC module.