IC Chip Carrier With Integrated Memory
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Solution Overview
Problem
Existing semiconductor chip packaging methods require attaching memory to IC chips before attaching them to a chip carrier, leading to reliability concerns and potential loss of otherwise reliable chips due to multiple unreliable processes.
Innovation Solution
An integrated circuit (IC) chip carrier with integrated memory, where access instructions and power are sent through vertical interconnects to memory contacts, allowing direct connection and operation without subjecting the IC chip to additional attachment processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If memory is attached to the IC chip before attaching to chip carrier, then memory can be connected by short wiring, but the IC chip is subjected to multiple unreliable attachment processes
Solution Approach 1:
The patent extracts the memory from the IC chip assembly process and integrates it directly into the chip carrier substrate. This separates the memory attachment process from the IC chip attachment process, allowing the IC chip to be mounted without undergoing memory attachment procedures. The memory is placed in a memory cavity within the carrier and connected via wiring lines on the substrate, eliminating the need for unreliable chip-to-chip memory attachment while maintaining short wiring lengths.
Solution Approach 2:
The patent segments the system into distinct functional components: the IC chip, the chip carrier with memory cavity, and the memory device. The carrier serves as an independent platform that integrates both the IC chip mounting area and the memory device, allowing separate optimization of each component's attachment process while maintaining close proximity for short wiring connections.
2Adaptability or versatility
If memory is attached to the IC chip, then memory is integrated with the chip, but the entire chip may need to be discarded due to reliability concerns
Solution Approach 1:
The patent extracts the memory from the IC chip and relocates it to the chip carrier substrate. This separation allows the IC chip to be independently mounted without being subjected to memory attachment processes. The memory is integrated into the carrier structure in a dedicated memory cavity, enabling the chip to be replaced or upgraded independently of the memory component.
Solution Approach 2:
The patent merges the memory device and IC chip mounting functions into a single chip carrier structure. The carrier integrates both the IC chip attachment area and the memory device with its cavity and wiring lines, creating a unified platform that provides both functions without requiring the IC chip to undergo multiple attachment processes.
3Adaptability or versatility
If multiple attachment processes are used, then memory can be integrated with IC chip, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the memory integration function from the IC chip assembly process and relocates it to the chip carrier manufacturing process. This allows memory to be integrated into the carrier substrate independently of the IC chip, simplifying the overall manufacturing process by eliminating multiple attachment steps while maintaining the benefit of integrated memory-chip connectivity.
Data Source
AI summary
An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. An access instruction may be sent from the IC chip to the memory through a wiring line of the IC chip carrier. Power potential may be sent from a system board to the memory through a vertical interconnect access (VIA). Alternatively, an access instruction may be sent from a first IC chip to the memory and power potential may be sent from a second IC chip to the memory.