IC Cell Intermediate Metal Layout for Power Routing Relief
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Solution Overview
Problem
The decreasing cell heights in integrated circuits (ICs) lead to scarce metal layer routing resources, particularly in the back-end-of-line (BEOL) due to the need for connections to power supply terminals, limiting the number of metal tracks that can be used for routing.
Innovation Solution
Utilizing intermediate gate connection metal layers to connect power supply terminals instead of the first metal layer, allowing for the conservation of routing resources in the M1 layer and enabling more tracks for signal application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If cell height is decreased to reduce chip area, then chip area is reduced, but metal layer routing resources become scarce
Solution Approach 1:
The patent introduces an intermediate metal layer (IM1) between the first metal layer (M1) and the second metal layer (M2) to provide additional routing dimension. This intermediate layer enables power supply terminals to be connected without consuming routing resources in the M1 layer, effectively adding a new dimensional space for metal routing within the constrained cell height.
Solution Approach 2:
The patent segments the metal routing function by separating power supply connections from signal routing. Power supply terminals are connected through the intermediate metal layer (IM1) and via holes, while the first metal layer (M1) is dedicated to signal routing. This segmentation allows independent optimization of power distribution and signal routing paths.
2Area of moving object
If cell height is decreased to reduce chip area, then chip area is reduced, but the number of metal tracks for signal routing decreases
Solution Approach 1:
By inserting an intermediate metal layer (IM1) between M1 and M2, the patent creates an additional routing dimension that does not consume horizontal space. This allows the M1 layer to be fully utilized for signal routing without being compromised by power supply connection requirements, thereby maintaining or increasing the number of available signal routing tracks despite reduced cell height.
Solution Approach 2:
The intermediate metal layer (IM1) acts as a mediator that handles power supply terminal connections, freeing up the first metal layer (M1) for exclusive signal routing use. This intermediary structure ensures that signal routing capacity is not reduced when cell height is decreased for chip area optimization.
3Reliability
If first metal layer is used to connect power supply terminals, then power supply connections are established, but routing resources in M1 layer are consumed
Solution Approach 1:
The patent segments the metal layer functions by dedicating the intermediate metal layer (IM1) to power supply connections and the first metal layer (M1) to signal routing. This functional segmentation ensures that power supply reliability is maintained while preserving routing resources in the M1 layer for signal transmission.
Solution Approach 2:
The intermediate metal layer (IM1) serves as an intermediary structure that handles power supply terminal connections, preventing direct consumption of M1 layer routing resources. This intermediary approach maintains power supply reliability while preserving the routing capacity of the first metal layer.
Data Source
AI summary
A cell on an integrated circuit is provided. The cell includes: a fin structure; an intermediate fin structure connection metal track disposed in an intermediate fin structure connection metal layer above the fin structure, the intermediate fin structure connection metal track being connected to the fin structure; and a first intermediate gate connection metal track disposed in an intermediate gate connection metal layer above the intermediate fin structure connection metal layer, the first intermediate gate connection metal track being connected to the intermediate fin structure connection metal track. A first power supply terminal is connected to the first intermediate gate connection metal track.