IC Cell Rail Layout for Lower Resistance and Faster Switching
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Solution Overview
Problem
The miniaturization of integrated circuits (ICs) has led to stricter design and manufacturing specifications, as well as reliability challenges, which existing electronic design automation (EDA) tools struggle to address effectively.
Innovation Solution
The proposed solution involves a specific layout design for IC structures that includes a first standard cell with active regions and a gate structure, along with rail structures for supplying voltage, which are optimized to enhance speed performance and reduce resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the IC structure is miniaturized to reduce device size and power consumption, then smaller devices with more functionality are achieved, but design and manufacturing specifications become stricter and reliability challenges increase
Solution Approach 1:
The patent introduces a three-dimensional stacked architecture with multiple tiers (first tier, second tier, third tier) containing standard cells and rail structures. This vertical dimensionality change allows the IC to maintain smaller planar footprint while providing sufficient active region area for reliable operation, effectively resolving the contradiction between miniaturization and manufacturing precision requirements.
Solution Approach 2:
The IC structure is segmented into multiple independent tiers with distinct functions - first tier contains first standard cells with first rail structures, second tier contains second standard cells with second rail structures, and third tier contains third standard cells with third rail structures. This segmentation allows each tier to be optimized independently for manufacturing while achieving overall miniaturization.
2Speed
If the active region area is increased to improve speed performance and reduce resistance, then better electrical performance is achieved, but the device area increases
Solution Approach 1:
The patent stacks multiple tiers vertically, each containing standard cells with rail structures. This vertical arrangement provides extensive active region area for high-speed performance without increasing the planar footprint, as the area expansion occurs in the vertical dimension rather than the horizontal plane.
Solution Approach 2:
The structure nests multiple standard cells and rail structures within each other across different tiers. Each tier contains complete functional units (standard cells with associated rail structures) that are nested vertically, allowing maximum utilization of three-dimensional space to achieve large effective area in a compact package.
Data Source
AI summary
An IC structure includes a first cell and a first and second rail. The first cell includes a first and second active region and a first, a second and a third gate structure. The first active region having a first dopant type. The second active region having a second dopant type. The first gate structure extending in a second direction, overlapping the first or the second active region. The second gate structure extending in the second direction, and overlapping a first edge of the first or second active region. The third gate structure extending in the second direction, and overlapping at least a second edge of the first or second active region. The first rail extending in the first direction and overlapping a middle portion of the first active region. The second rail extending in the first direction and overlapping a middle portion of the second active region.