IC Chip Card Biometric Authentication Module
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Solution Overview
Problem
Current integrated circuit (IC) chip cards face security risks due to fraudulent use of lost and stolen cards, and existing data encryption and biometric authentication solutions are not practical or cost-effective for widespread implementation in the payment card industry.
Innovation Solution
A chip card design featuring an integrated circuit (IC) chip module with a substrate and contact pads for biometric signal processing, allowing for authentication and secure transactional use, while being compact and customizable to comply with industry standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If data encryption solutions and elaborate IC chip designs are implemented to address security concerns, then security is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent divides the security system into separate functional modules: the base IC chip contains payment account data and encryption capabilities, while biometric authentication is handled by a separate sensor and processing unit. This segmentation allows each component to be optimized independently and simplifies manufacturing by enabling modular assembly of different security features.
Solution Approach 2:
The IC chip module is designed to support multiple authentication methods (biometric and traditional encryption) within a single standardized form factor compliant with ISO/IEC 7810. This multi-functionality allows the same physical card to provide both payment processing and biometric verification without requiring separate devices.
2Reliability
If biometric sensors and additional electrical components are embedded in IC chip cards to enable biometric authentication, then security is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates the biometric sensor pads and signal processing circuitry directly into the IC chip module during manufacturing, so that biometric authentication capability is built-in from the outset. This preliminary integration eliminates the need for separate assembly steps and reduces manufacturing complexity by treating biometric functionality as a standard feature rather than an add-on.
Solution Approach 2:
The patent combines the biometric sensor, signal processing circuitry, and payment IC chip into a single integrated module that fits within the standard card form factor. This merging of functions into one compact unit simplifies manufacturing by reducing the number of separate components that need to be handled and assembled.
3Adaptability or versatility
If multiple contact pads and biometric sensors are integrated into the IC chip module, then functionality is improved, but device compactness becomes more difficult to achieve
Solution Approach 1:
The patent utilizes the vertical dimension by integrating contact pads on both the top and bottom surfaces of the IC chip substrate. This three-dimensional arrangement of electrical contacts allows multiple functional interfaces (biometric sensors, payment contacts, power supply) to be packed into a compact footprint without increasing the card's planar dimensions.
Solution Approach 2:
The patent places the biometric sensor pads and contact pads in overlapping or adjacent regions on the IC chip substrate, with signal processing circuitry positioned underneath or between the contact elements. This nested arrangement allows multiple functional layers to coexist within a small volume, maintaining compactness while providing diverse functionality.
Data Source
AI summary
An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module may further include conductive protrusions supportably connected to the inward-facing surface and having protruding ends that extend in to a thickness of corresponding embedded conductive contacts of the card body.