IC Chip Card Biometric Sensor Pads
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Solution Overview
Problem
The payment card industry faces escalating security risks due to fraudulent use of lost and stolen chip cards and unauthorized transactions, with existing data encryption solutions and biometric authentication efforts not being cost-effective or practical for widespread implementation.
Innovation Solution
A chip card design incorporating an integrated circuit (IC) chip module with biometric sensor pads on one side and contact or contactless payment functionality, using a substrate with outward-facing conductive pads for user engagement and an IC chip for processing biometric signals to authenticate the user, facilitating secure transactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If data encryption solutions and elaborate IC chip designs are used to address security concerns, then security against fraudulent transactions is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The IC chip module is divided into distinct functional components: a substrate providing structural support and electrical interconnection, contact pads for biometric sensing, and an IC chip for signal processing. This segmentation allows each component to be optimized independently while simplifying overall manufacturing and assembly processes.
Solution Approach 2:
The contact pads serve multiple functions: they provide electrical connection for the IC chip and simultaneously function as biometric sensor elements for capturing physiological signals. This multi-functionality reduces the number of separate components needed, thereby simplifying device complexity while maintaining security.
2Reliability
If biometric authentication is integrated into chip cards to prevent fraudulent use, then security against lost and stolen cards is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The biometric sensing functionality is merged directly into the contact pads that are already part of the IC chip module structure. By combining the authentication function with existing structural elements, the patent avoids adding separate biometric components, thereby controlling manufacturing complexity and cost while enabling biometric authentication.
3Adaptability or versatility
If integrated IC chip modules with biometric sensors are used, then user authentication capability is improved, but device complexity increases
Solution Approach 1:
The IC chip is electrically interconnected to the contact pads, allowing the chip to automatically process the biometric signals captured by the pads without requiring external processing equipment. This self-service capability reduces system complexity by integrating all necessary functions within the chip card itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated IC chip module enhances security by authenticating users through biometric signals, reducing fraudulent transactions, and allows for cost-effective production and customization of chip cards that comply with industry standards, providing both contact and contactless payment capabilities.
Implementation Method 1
a first plurality of contact pads (e.g., electrically conductive/isolated pads) supportably interconnected to an outward-facing surface of the substrate for contact engagement with at least one appendage of a user
Data Source
AI summary
An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for contact engagement with at least one appendage of a user. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for engaging a contact card reader for contact communication signal transmissions and/or a first antenna supportably interconnected to the inward-facing surface of the substrate for contactless communication signal transmissions with a contactless card reader. Communication signal processing may be completed by the first IC chip and/or a second IC chip supportably interconnected to the inward-facing surface of the substrate.