IC Chip Temperature Control via Heated Socket Cover

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Solution Overview

Problem

Existing temperature control apparatuses for IC chip testing fail to maintain a consistent temperature condition, leading to reduced test quality and reliability due to heat influence from the tester head and handler, requiring costly modifications.

Innovation Solution

A temperature control apparatus comprising a socket holder, a socket cover, and a gas supplying unit that forms a closed space around the IC chip, allowing for precise temperature control by externally supplying gas at a predetermined temperature using high-temperature and low-temperature gas generation units controlled by a microcomputer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the socket and pusher are used without temperature control, then the test setup is simple and low cost, but the IC chip cannot be maintained at the desired test temperature due to heat influence from the tester head and handler

Engineering Contradiction:

ImproveIC chip test temperatureVSAvoidtester head and handler structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The invention divides the temperature control function into a separate, independent module (the adapter with heated chamber) rather than modifying the entire tester head and handler system. This segmentation allows temperature control to be added to the socket area without complex modifications to the main testing equipment.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adapter acts as an intermediary component between the IC chip/socket and the tester head. It provides a heated chamber that mediates the thermal environment, allowing the IC chip to be maintained at the desired temperature while the tester head and handler remain unchanged.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If the socket and pusher are modified to control temperature, then the IC chip test temperature can be maintained, but the modification cost is high and increases the cost of IC chip test

Engineering Contradiction:

ImproveIC chip test temperatureVSAvoidtester head and handler manufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

By segmenting the temperature control function into a separate adapter module, the invention avoids costly modifications to the expensive tester head and handler systems. The adapter can be manufactured independently at lower cost and attached to the existing socket.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adapter serves as a relatively simple, replaceable component that provides temperature control without requiring expensive modifications to the main testing equipment. It is a cost-effective solution that can be manufactured and replaced more easily than modifying the entire tester system.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Temperature

If a high-temperature bath is used to hold IC chips, then the IC chip can be maintained at high temperature, but the socket cools the IC chip immediately after placement, resulting in temperature lower than desired

Engineering Contradiction:

ImproveIC chip test temperatureVSAvoidhandler and socket structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The adapter pre-heats the chamber and maintains the thermal environment before the IC chip is placed on the socket. This preliminary temperature preparation ensures that the IC chip remains at the desired temperature immediately upon placement, eliminating the cooling effect that occurs with conventional sockets.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adapter provides localized temperature control specifically at the socket/chip interface area through the heated chamber, while the rest of the handler and socket structure remains conventional. This local quality approach maintains temperature where needed without requiring complex modifications throughout the entire system.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy and cost-effective provision of a suitable test temperature environment for IC chips, maintaining test quality and reliability by ensuring accurate temperature conditions during testing.

Implementation Method 1

a gas supplying unit which externally supplies the closed space with gas of a predetermined temperature

Methodology Applied

Scientific EffectThermal convection: Convection

Data Source

PatentUS7479795B2Temperature control apparatus

Publication Date: 2009.01.20 SYNAX

AI summary

A temperature control apparatus includes a socket holder which is provided on a tester head and holds a socket to mount an IC chip. A socket cover has an opening to pass the end of a handler pusher for holding the IC chip on testing. The socket cover forms a closed space around the IC chip in a state that the IC chip is pressed to the socket by the pusher. A gas supplying unit externally supplies the closed space with gas of a predetermined temperature.