Integrated Circuit Chip Thermal Management via Substrate Metal Plate

A metal plate is introduced as an intermediary thermal management component between the processor chip and memory chip. The metal plate serves as a heat sink that captures and dissipates heat generated by the processor chip, preventing thermal degradation of the memory chip performance while enabling the stacked configuration to maintain both high productivity and acceptable temperature levels.

The substrate wafer is segmented into functional zones with the metal plate integrated at specific locations to handle thermal management independently. This segmentation allows the processor chip and memory chip to operate in thermally differentiated environments, with the metal plate creating a thermal boundary that protects the memory chip from processor heat while maintaining compact stacked architecture.

The metal plate is merged with the substrate wafer structure, integrating thermal management functionality directly into the existing substrate. This combining approach allows the metal plate to serve multiple purposes: as a heat sink for thermal management, as a structural element of the substrate wafer, and as a platform for mounting intermediate metal elements, thereby improving temperature control without proportionally increasing device complexity.

The metal plate performs multiple functions within the electronic device: it acts as a heat sink to capture processor heat, provides a mounting surface for intermediate metal elements that connect to both the processor and memory chips, and serves as a structural component of the substrate wafer. This multi-functionality enables effective thermal management while minimizing the increase in device complexity.