IC Chip Modules Flexible Substrate Automation
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Solution Overview
Problem
The existing methods for producing IC chip modules for payment objects are costly and complex due to the use of card bodies and fixed interconnections, which increase material and production costs, as well as manufacturing complexities.
Innovation Solution
An improved system and method that involves fixing an IC chip and its antenna to a flexible carrier for co-movement, with optional contact pads, and encoding personalization and issuer key data in the IC chip module before locking it to restrict access, allowing for automated processing and packaging without fixed interconnections to a card body or other structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If IC chips are fixedly interconnected to card bodies with breakout portions, then automated handling and encoding is enabled, but material and production costs increase
Solution Approach 1:
The invention extracts the IC chip module from the traditional card body structure, eliminating the need for card bodies, breakout portions, and associated interconnection components. The IC chip module is provided as a standalone unit that can be directly integrated into payment objects, removing unnecessary structural elements while maintaining automated handling capabilities through specialized carrier arrangements.
Solution Approach 2:
The invention segments the payment system into modular components: the IC chip module is separated from the card body structure and can be independently produced, tested, and integrated. This segmentation allows for specialized manufacturing processes optimized for each component, reducing overall production complexity and cost while enabling flexible integration into different payment object formats.
2Extent of automation
If card bodies with breakout portions are used, then automated handling is achieved, but manufacturing complexities increase
Solution Approach 1:
The invention removes the complex card body structure with its scored breakout portions from the IC chip module production process. By providing the IC chip module as a standalone component, the invention eliminates the need for complex card body manufacturing, scoring operations, and breakout portion separation processes, thereby reducing manufacturing complexities while preserving automated handling through carrier-based processing.
3Strength
If IC chips are incorporated into card bodies, then structured support is provided, but material usage increases
Solution Approach 1:
The invention extracts the IC chip module from the card body structure, eliminating material consumption associated with card body production, breakout portion creation, and interconnection components. The IC chip module is provided in a compact, self-contained form that uses minimal materials while maintaining structural integrity through specialized carrier arrangements during handling and integration.
4Stability of the object's composition
If fixed interconnections are used, then structural stability is ensured, but production costs increase
Solution Approach 1:
The invention removes the need for fixed interconnections between IC chips and card bodies by providing the IC chip module as a standalone component. This eliminates the materials and processes required for creating fixed interconnections, such as conductive adhesives, wire bonds, and mechanical fasteners, thereby reducing production costs while maintaining structural stability through integrated module design.
Data Source
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AI summary
A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.