Electronic Component Mounting Device for IC Chips
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Solution Overview
Problem
Conventional methods for mounting IC chips on electronic devices are inefficient, lack accuracy, and incur high costs due to the need for precise control of chip positions and sheet stretching, as well as the requirement for multiple types of antenna sheets and plates, which complicates the manufacturing of various products.
Innovation Solution
An electronic component mounting device featuring a removal mechanism, a transport mechanism that adjusts intervals between IC chips, and a mounting and transfer mechanism to simultaneously place IC chips on attachments with predetermined intervals, allowing for efficient and accurate mounting, and easy configuration for different attachment types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If IC chips are individually removed and mounted on attachments, then mounting accuracy can be maintained, but productivity is low and efficiency is reduced
Solution Approach 1:
The patent combines multiple IC chip mounting operations into a single simultaneous process. The removal mechanism removes multiple IC chips from the semiconductor wafer at once, and the mounting mechanism mounts them on multiple attachments simultaneously, rather than performing individual operations sequentially. This merging of operations maintains mounting accuracy while dramatically improving productivity.
Solution Approach 2:
The patent segments the mounting process into distinct functional modules: a removal mechanism for extracting IC chips, a transport mechanism for moving them, and a mounting mechanism for placing them on attachments. This segmentation allows each module to be optimized independently while working together to achieve both high accuracy and high efficiency through parallel processing.
2Manufacturing precision
If an elastic sheet is used to adjust IC chip intervals, then mounting can be achieved, but high accuracy requires precise control of chip positions, sheet stretching, and uniformity
Solution Approach 1:
The patent replaces the elastic sheet stretching mechanism with a direct transport mechanism that moves IC chips along a predetermined path. This substitution eliminates the need for complex control of sheet stretching properties and uniformity, while maintaining high positioning accuracy through mechanical guidance and controlled transport.
Solution Approach 2:
The patent changes the approach from adjusting intervals through elastic deformation to directly controlling transport parameters. The transport mechanism is designed to move IC chips at specific intervals along a defined path, transforming the problem from one of material property control to one of motion parameter control, which is more easily managed and reproduced.
3Adaptability or versatility
If different antenna sheets or plates are used for different attachment types, then mounting requirements can be met, but cost increases due to manufacturing variety
Solution Approach 1:
The patent designs a universal mounting device that can handle different attachment types through programmable control. The transport mechanism can be configured to move IC chips at different intervals, and the mounting mechanism can accommodate various attachment configurations without requiring different physical hardware components. This multi-functionality reduces manufacturing costs by eliminating the need to produce multiple specialized sheets and plates.
Data Source
AI summary
An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.